Lead Frame Gap Structure for High-Voltage Field Leakage Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electrical field leakage from semiconductor packages can lead to device failure, particularly as packages become smaller or include higher voltage semiconductor devices, where increased electric field leakage occurs.
Innovation Solution
The solution involves creating a gap between die attach pads with varying widths, where the first and second portions of the gap are wider than the intermediate portion, reducing metal density and thus minimizing electric field volume, and attaching semiconductor dies to these pads using a conductive or insulating adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor packages are made smaller or higher voltage devices are included, then device integration and voltage capability are improved, but electric field leakage increases causing device failure
Solution Approach 1:
The gap between die attach pads is segmented into multiple portions with different widths, creating zones of varying metal density that segment the electric field paths and prevent leakage
Solution Approach 2:
Different portions of the gap have different metal density characteristics - wider portions reduce electric field concentration while the intermediate portion maintains necessary electrical properties, creating local quality variations to control field distribution
2Object-affected harmful factors
If metal density is reduced to minimize electric field volume, then electric field leakage is prevented, but die attach pad area is reduced
Solution Approach 1:
The die attach pad structure is segmented into different metal density zones along the gap, allowing reduction of metal density in critical areas while preserving adequate pad area at attachment points
Solution Approach 2:
Metal density is locally optimized - wider gap portions have reduced metal density to minimize electric field volume, while intermediate portions maintain higher density to preserve die attach functionality
Data Source
AI summary
An apparatus includes a first die attach pad and a second die attach pad. A first die is attached to the first die attach pad and a second die is attached to the second die attach pad. The first die attach pad and the second die attach pad are separated by a gap. A first edge of the first die attach pad adjacent to the gap is thinner than a second edge of the first die attach pad. The first edge of the first die attach pad is opposite the second edge of the first die attach pad. A first edge of the second die attach pad adjacent to the gap is thinner than a second edge of the second die attach pad. The first edge of the second die attach pad is opposite the second edge of the second die attach pad.