Lead-Frame Grid Array IC Packaging with Insulation Cover
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in miniaturization, cost reduction, and manufacturing efficiency, particularly in portable devices, where smaller and thinner IC packages are required to enhance portability and performance while maintaining low costs and high yields.
Innovation Solution
The proposed solution involves a lead-frame grid-array system with a conductive land and insulation cover, where the insulation cover is directly formed on the routing layer without inner support portions, enabling flexible stacking and integration configurations, improved yield, and reduced manufacturing complexity and costs. This system includes a connection opening for the integrated circuit die and a top and bottom encapsulation, with the conductive land shaped from the bottom side to provide mold lock capability and prevent shorts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional IC packaging structures are used, then structural integrity and electrical connectivity are maintained, but packaging dimensions remain large and manufacturing complexity increases
Solution Approach 1:
The patent removes the inner support portion from the insulation cover structure, extracting only the essential functional elements (routing layer, connection opening, encapsulation) while eliminating unnecessary structural components. This reduction in structural complexity enables smaller packaging dimensions and simpler manufacturing processes.
Solution Approach 2:
The insulation cover is segmented into distinct functional regions: a routing layer with conductive lands for electrical connections, a connection opening for die attachment, and encapsulation portions for protection. This segmentation allows optimized positioning of each function, reducing overall package size while maintaining manufacturing simplicity.
2Volume of moving object
If miniaturization is pursued to reduce device size, then portability is improved, but manufacturing yield and reliability may deteriorate
Solution Approach 1:
The routing layer is formed with pre-defined conductive lands and connection openings before die attachment. This preliminary structuring ensures precise alignment and reliable electrical connections are established upfront, maintaining high manufacturing yield even as device dimensions are reduced for better portability.
Solution Approach 2:
The insulation cover acts as an intermediary structure between the lead frame and the integrated circuit die, providing a stable platform with pre-formed connection points. This intermediary layer ensures reliable electrical and mechanical connections while enabling miniaturized packaging without compromising manufacturing yield.
3Ease of manufacture
If cost reduction is achieved through simplified structures, then manufacturing efficiency improves, but protection against electrical shorts and structural integrity may worsen
Solution Approach 1:
The insulation cover provides localized electrical insulation precisely where needed - around conductive lands and connection openings - rather than requiring a completely enclosed structure. This localized approach maintains protection against electrical shorts while simplifying the overall structure for more efficient manufacturing.
Solution Approach 2:
The routing layer is formed by shaping the lead frame itself, utilizing the existing metal structure rather than adding separate expensive conductive layers. This approach reduces manufacturing costs and complexity while maintaining adequate electrical connection functionality and short protection.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes providing a lead-frame having an inner portion and a bottom cover directly on a bottom surface of the inner portion; forming an insulation cover directly on the lead-frame with the insulation cover having a connection opening; connecting an integrated circuit die to the lead-frame through the connection opening with the integrated circuit die over the insulation cover; forming a top encapsulation directly on the insulation cover; forming a routing layer having a conductive land directly on the bottom cover by shaping the lead-frame; and forming a bottom encapsulation directly on the conductive land with the bottom cover exposed from the bottom encapsulation.