Lead Frame Semiconductor Package for Heat Dissipation and Bonding
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Solution Overview
Problem
Semiconductor packages face challenges with heat dissipation and manufacturing complexity, particularly in power semiconductor packages, which can lead to increased failure rates and energy loss due to internal heat generation and the need for maintaining thermal and physical durability without complicating the manufacturing process.
Innovation Solution
The semiconductor package design includes a first and second lead frame with protrusions and a spacer, allowing for improved heat dissipation and bonding reliability by increasing the bonding surface area between the semiconductor element and the lead frames, while simplifying the manufacturing process by eliminating the need for a separate mounting substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate mounting substrate is used to support the semiconductor element, then the structural integrity and thermal durability are maintained, but the device complexity and manufacturing process become complicated
Solution Approach 1:
The patent merges the mounting substrate function with the lead frame structure by integrating the semiconductor element directly onto the lead frame. The lead frame serves dual purposes as both the electrical connection component and the mechanical support structure, eliminating the need for a separate mounting substrate and simplifying the manufacturing process while maintaining structural integrity
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: providing electrical connections, offering mechanical support for the semiconductor element, and facilitating heat dissipation. This multi-functional design replaces the need for separate specialized components, reducing device complexity while maintaining reliability
2Reliability
If the bonding surface area between the semiconductor element and lead frame is increased, then the bonding reliability is improved, but the device complexity increases
Solution Approach 1:
The patent extends the bonding interface from a simple planar surface to a three-dimensional structure by forming protrusions on the lead frame that wrap around and contact multiple surfaces of the semiconductor element. This dimensional expansion increases the bonding surface area and mechanical interlocking without requiring additional separate components or complex assembly procedures
3Loss of energy
If heat dissipation is improved by increasing bonding surface area, then energy loss is reduced, but the manufacturing precision requirements increase
Solution Approach 1:
The protrusions are pre-formed on the lead frame with predetermined geometries and positions that are designed to automatically align with corresponding features of the semiconductor element during assembly. This preliminary structuring ensures proper alignment and maximizes thermal contact area without requiring high-precision alignment operations during the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces energy loss and enhances bonding reliability, improving the semiconductor package's thermal management and manufacturing efficiency by allowing heat to be transferred easily and maintaining structural integrity without complicating the manufacturing process.
Implementation Method 1
the second lead frame includes a hole that overlaps the second contacting portion... allowing for improved heat dissipation... heat to be transferred easily
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first lead frame and a second lead frame that face each other; and a semiconductor element that is disposed between the first lead frame and the second lead frame, wherein the semiconductor element is connected to the first lead frame through a first contacting portion, and is connected to the second lead frame through a second contacting portion. The second lead frame includes a hole that overlaps the second contacting portion.