Lead-Frame Heatsink Layout for Multi-Surface Chip Cooling

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Solution Overview

Problem

Heat management in semiconductor applications has become increasingly challenging with advancements in semiconductor materials, feature sizes, die-chip size, and power demands, necessitating improved thermal dissipation solutions.

Innovation Solution

A heatsink device comprising a lead-frame with multiple heatsinks and tie-bars, separated by insulators or lead-pads, coupled to a die-pad for efficient heat conduction and dissipation, which can be embedded in a QFN package for enhanced thermal performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If multiple heatsinks are integrated into the lead-frame, then thermal dissipation capability is improved, but device complexity increases

Engineering Contradiction:

Improvethermal dissipation capabilityVSAvoiddevice complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent combines multiple heatsinks and tie-bars into a single integrated lead-frame structure, where the heatsinks are formed as integral parts of the lead-frame rather than separate components. This merging approach improves thermal dissipation by providing multiple heat dissipation paths while avoiding the complexity of assembling separate heatsink components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lead-frame structure serves multiple functions simultaneously: it provides mechanical support for the semiconductor device, electrical connectivity through lead-pads, and thermal dissipation through integrated heatsinks. The tie-bars also serve dual purposes of mechanical reinforcement and thermal conduction pathways.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If heatsinks are separated by insulators or lead-pads, then electrical isolation is improved, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical isolationVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The insulators are integrated directly into the lead-frame structure as non-conductive regions formed during the same manufacturing process, rather than being separate components requiring additional assembly steps. This approach ensures proper electrical isolation between adjacent heatsinks and lead-pads while maintaining manufacturing efficiency.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The heatsink device effectively dissipates heat through multiple surfaces, improving thermal management and enabling operation of semiconductor devices at lower temperatures, particularly suitable for quantum computational devices.

Implementation Method 1

coupled to a die-pad for efficient heat conduction and dissipation

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

The heatsink device effectively dissipates heat through multiple surfaces

Methodology Applied

Scientific EffectThermal dissipation: Heat Sink

Data Source

PatentUS20250338447A1Heatsink device

Publication Date: 2025.10.30 NXP BV

AI summary

One example discloses a heatsink device, including: a lead-frame having a die-pad, a first edge, a second edge, a third edge, and a fourth edge; wherein the lead-frame also includes a set of heatsinks, including, a first heatsink located where the first edge and the fourth edge of the lead-frame intersect; a second heatsink located where the first edge and the second edge of the lead-frame intersect; and a third heatsink located where the second edge and the third edge of the lead-frame intersect.