Lead Frame Heat Radiating Holes for LED Packages

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing semiconductor packages, particularly LED packages, face issues with heat dissipation leading to product degradation, increased volume, weight, and manufacturing time due to the need for separate heat radiating means like heat sinks, which limit their form, shape, and usage.

Innovation Solution

A lead frame design with integrated heat radiating holes and openings that allows for direct heat dissipation without additional heat sinks, featuring anodes and cathodes with molding parts, terminal parts, and chip attachment areas with increased surface areas for enhanced heat conductivity and airflow, enabling efficient heat transfer without external heat radiating means.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a separate heat sink is used for heat dissipation, then heat radiating performance is improved, but device volume and weight increase

Engineering Contradiction:

Improveheat radiating performanceVSAvoiddevice volume

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The patent merges the heat dissipation function into the lead frame structure itself by forming heat radiating protrusions directly on the lead frame. This integration eliminates the need for separate heat sinks while maintaining effective heat dissipation, thereby reducing overall device volume and weight.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The lead frame is designed to perform multiple functions: electrical connection, mechanical support, and heat dissipation. The heat radiating protrusions enable the lead frame to serve as both a structural component and a thermal management solution, eliminating the need for dedicated heat sinking components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a separate heat sink is used for heat dissipation, then heat radiating performance is improved, but manufacturing time and cost increase

Engineering Contradiction:

Improveheat radiating performanceVSAvoidmanufacturing time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

The heat radiating protrusions are formed as an integral part of the lead frame through a single molding process. This integration eliminates separate manufacturing steps for heat sink production and assembly, significantly reducing manufacturing time and process complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat radiating structure is pre-formed during the lead frame manufacturing process itself, rather than being added as a separate component later. This preliminary integration of the heat dissipation function into the base structure eliminates subsequent assembly steps and reduces overall manufacturing time.

Inventive Principle:

Principle #10Preliminary action

3Ease of manufacture

If the lead frame structure is simplified without heat radiating means, then manufacturing cost is reduced, but heat dissipation capability deteriorates

Engineering Contradiction:

Improvemanufacturing costVSAvoidheat dissipation capability

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The heat radiating protrusions are formed as an integral part of the lead frame through a single molding process using the same material. This integration maintains manufacturing simplicity and cost-effectiveness while simultaneously providing effective heat dissipation capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat radiating protrusions create a surface structure that increases the effective heat dissipation area. This surface geometry enhancement improves thermal radiation capability without adding complex internal structures or expensive materials, maintaining manufacturing simplicity.

Inventive Principle:

Principle #31Porous materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The lead frame provides reliable and efficient heat dissipation, reducing manufacturing costs and product size, ensuring long-term reliability and performance by integrating heat generating and radiating functions, eliminating the need for separate heat sinks and simplifying the manufacturing process.

Implementation Method 1

The important point is how to design the heat radiation structure so that heat is dischargeable to the outside by effectively transmitting thermal energy caused by a temperature difference

Methodology Applied

Scientific EffectHeat radiation: Thermal Radiation

Implementation Method 2

The lead frame itself is used as a heat radiating means... Heat generated in the package may be discharged to air through the PCB and the heat radiating means

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10593613B2Lead frame and semiconductor package including the same

Publication Date: 2020.03.17 BKTECH

AI summary

Disclosed are a lead frame for a semiconductor package, comprising: an anode 10, a cathode 20, a molding part 30, terminal parts 90 and 91, wherein one or more heat radiating holes 40, one or more chip attachment parts 50 which have a wider surface area than surface areas of semiconductor chips 55 to be attached, one or more upper openings 70 and 71 are positioned in an upper portion of the lead frame, and wherein one or more heat radiating holes 40, one or more first lower openings 60, and one or more second lower openings 80 are positioned in a lower portion of the lead frame; a semiconductor package including the lead frame; and a lighting apparatus including the semiconductor package.