Lead Frame Image Inspection for Foreign Object Detection Before Molding
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Solution Overview
Problem
Current semiconductor molding processes face challenges due to manual inspection of lead frames, leading to increased labor costs and potential damage from foreign objects during the molding process.
Innovation Solution
A semiconductor molding system incorporating a foreign object detection method using an image collection device and a controller to compare target images of lead frames with pre-set reference images, automatically detecting foreign objects in non-molding areas and triggering shutdown or alarm mechanisms as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual inspection is used to detect foreign objects on lead frames, then foreign objects can be identified, but labor costs increase and manual operation may cause additional damages
Solution Approach 1:
The patent replaces the manual mechanical inspection system with an automated optical imaging system. The image collection device captures images of lead frames, and the controller automatically processes these images to detect foreign objects, substituting human manual inspection with an automated optical-electrical system that eliminates labor costs while maintaining detection accuracy
Solution Approach 2:
The patent creates a digital copy (image) of the lead frame using the image collection device. This optical copy is then processed by the controller to detect foreign objects, allowing multiple inspections of the same lead frame without additional manual intervention and enabling automated analysis that reduces both labor costs and the risk of manual damage
2Reliability
If manual inspection is performed on lead frames, then foreign objects can be removed, but labor costs increase
Solution Approach 1:
The automated inspection system enables continuous operation without the interruptions inherent in manual inspection. The image collection device and controller can process lead frames continuously at production speed, eliminating the need for workers to periodically remove and replace inspected items, thereby maintaining continuous productive action while ensuring quality control
Solution Approach 2:
The system replaces time-consuming manual inspection and removal operations with automated optical detection and mechanical ejection. The controller automatically identifies foreign objects in images and triggers ejection mechanisms to remove defective lead frames, significantly reducing the time required for quality control while maintaining high reliability
3Reliability
If manual inspection operations are performed, then foreign objects can be detected, but improper operation may cause additional damages to lead frames
Solution Approach 1:
The patent replaces manual handling and inspection operations with an automated system that uses optical imaging for detection and controlled mechanical ejection for removal. This substitution eliminates the variability and potential for damage caused by manual operations, as the automated system can detect foreign objects and trigger precise, controlled ejection without the unpredictable forces applied during manual handling
Solution Approach 2:
The patent introduces an intermediary ejection mechanism between the detection and removal stages. The controller detects foreign objects through image analysis and then activates an ejection device that precisely removes defective lead frames without direct human contact. This intermediary mechanism acts as a buffer that eliminates the harmful effects of improper manual operation while maintaining effective foreign object detection and removal
4Productivity
If automated image collection and comparison is implemented, then labor costs are reduced, but device complexity increases
Solution Approach 1:
The controller serves multiple functions: it controls the image collection device, processes images to detect foreign objects, determines which lead frames need ejection, and activates the ejection mechanism. By consolidating these diverse functions into a single controller, the system achieves high automation and productivity while minimizing the number of separate components, thereby managing device complexity effectively
Solution Approach 2:
The patent merges the image collection device, image processing functions, and ejection control into an integrated automated inspection system. The controller combines multiple operational functions into a unified system that automatically transitions from image capture to defect detection to defective item ejection, achieving high productivity through integration while keeping the overall device structure manageable through functional consolidation
Data Source
AI summary
A semiconductor molding system is provided that includes a molding device, an image collection device, and a controller connected to the molding device and the image collection device. The image collection device is configured to obtain a target image of a to-be-molded lead frame before the to-be-molded lead frame is molded by the molding device. The controller is configured to determine whether foreign object(s) exist in a non-molding area of the to-be-molded lead frame based on the target image of the to-be-molded lead frame and a reference image. A method for detecting foreign objects of a to-be-molded lead frame is also provided.