Lead Frame Layout for Compact Insulated Power Semiconductors
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Solution Overview
Problem
Conventional semiconductor devices face challenges in downsizing while maintaining electrical insulation distance due to the length of the inclined portion of the first lead frame, which affects the distance between the first and second lead frames.
Innovation Solution
The semiconductor device incorporates an intermediate frame between the second portion of the first lead frame and the fifth portion of the second lead frame, reducing the distance between them in the first direction while ensuring electrical insulation, and includes a thermally conductive member connected to the semiconductor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the inclined portion of the first lead frame is made longer to ensure electrical insulation distance, then the electrical insulation distance is improved, but the overall device size increases
Solution Approach 1:
The patent introduces an intermediate frame positioned between the first and second lead frames in the vertical direction (thickness direction). This spatial arrangement in a different dimension allows the lead frames to be separated without requiring a long inclined portion that would increase the device's planar size, thus resolving the contradiction between insulation distance and device compactness
Solution Approach 2:
The intermediate frame acts as a mediator structure positioned between the first and second lead frames. It provides physical separation and maintains the required electrical insulation distance while allowing the device to maintain a compact form factor, as the intermediate frame occupies the vertical space rather than requiring extended horizontal or diagonal dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a downsized semiconductor device that maintains the necessary electrical insulation distance, facilitating a more compact design.
Implementation Method 1
a thermally conductive member that is thermally connected to the semiconductor element and partially exposed from the sealing member, and the thermally conductive member is thermally connected to a cooler made from metal
Data Source
AI summary
A semiconductor device includes: a semiconductor element, a first lead frame, a second lead frame, and a thermally conductive member; and a sealing member sealing them. The first lead frame includes: a first portion exposed from a first side surface of the sealing member; and a second portion located closer to a lower surface of the sealing member than the first portion in a second direction crossing the lower surface. The semiconductor device further includes an intermediate frame which is located between the second portion and the fifth portion at least in the second direction. A distance, in the first direction, between the second portion and the intermediate frame is shorter than a distance, in the second direction, between an upper surface of the first portion and the upper surface of the second portion.