Lead Frame Interposer Assembly for Precise Floating Lead Packaging
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Solution Overview
Problem
Existing lead frame technologies face challenges in efficiently integrating floating leads into packaged semiconductor devices without additional fabrication steps and ensuring precise electrical connectivity.
Innovation Solution
The use of a pre-molded interposer with conductive leads, which is inserted into a pre-plated frame, allows for the secure positioning and electrical connection of floating leads without the need for separation processes, enabling improved electrical connectivity by aligning conductive leads with the frame's connection points.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional lead frame technologies are used to integrate floating leads, then additional fabrication steps (separation processes) are required, but this increases device complexity and reduces manufacturing efficiency
Solution Approach 1:
The lead frame is segmented into distinct components: a support frame structure and separate floating lead elements. The floating leads are pre-formed as discrete components that can be independently positioned and attached to the support frame, eliminating the need for complex separation processes during fabrication. This segmentation allows for simplified manufacturing while maintaining electrical connectivity functions.
2Manufacturing precision
If floating leads are integrated without precise positioning mechanisms, then fabrication is simpler, but electrical connectivity precision deteriorates
Solution Approach 1:
A support frame structure serves as an intermediary component between the floating leads and the final electrical connection points. This support frame provides a structured platform with defined positioning features that guide and secure the floating leads in precise locations, ensuring accurate electrical connectivity without requiring complex direct positioning mechanisms.
Solution Approach 2:
The floating leads are pre-formed and pre-positioned on the support frame before final assembly. This preliminary positioning action ensures that the floating leads are already in their correct locations and orientations, eliminating the need for complex positioning adjustments during subsequent fabrication steps and guaranteeing precise electrical connectivity.
3Manufacturing precision
If additional fabrication steps are used to ensure precise positioning of floating leads, then manufacturing precision improves, but productivity decreases
Solution Approach 1:
By segmenting the lead frame into a support frame and separate floating leads, the floating leads can be pre-formed and pre-positioned as discrete components. This segmentation enables parallel processing where multiple floating leads can be positioned simultaneously on the support frame, improving manufacturing precision without significantly reducing overall productivity.
Data Source
AI summary
In described examples, a packaged semiconductor device includes a frame, a pre-fabricated interposer, and an integrated circuit die. The frame includes multiple conductive frame leads and multiple conductive connection points, as well as a hole in the frame surrounded by the frame leads and the conductive connection points. The pre-molded interposer has an external perimeter including multiple conductive interposer leads, and is for insertion into the hole. At least one of the interposer leads does not extend to the external perimeter of the interposer. The die is electrically coupled to selected ones of the frame leads and of the interposer leads. The interposer is inserted into the hole and coupled to the frame, and the frame, interposer, and die are together encapsulated by encapsulation material.