Lead Frame Laser Projection Module for Automated Assembly
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Solution Overview
Problem
Conventional laser module designs are expensive, require complicated printed circuit board assemblies, and have excessively long cycle times, making them unsuitable for full automation.
Innovation Solution
A simplified laser projection module design utilizing a lead frame configuration with inner and outer portions, integrated heat sinks, and diffractive optical elements, allowing for miniaturization and easier assembly, which can be automated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional laser module designs are used, then functional performance is achieved, but manufacturing cost increases and device complexity increases
Solution Approach 1:
The patent merges the laser diode, heat sink, and optical components onto a single lead frame substrate, eliminating the need for separate PCBA assemblies. The lead frame serves as both the electrical interconnection structure and the mechanical mounting platform, consolidating multiple functions into one integrated component that reduces overall device complexity while maintaining performance.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: it provides electrical connections, mechanical support, thermal management through integrated heat sinks, and optical alignment references. This multi-functional design eliminates the need for separate specialized components, reducing both device complexity and manufacturing cost.
2Reliability
If conventional laser module designs are used, then functional performance is achieved, but manufacturing cycle time increases
Solution Approach 1:
The laser diode and heat sink are pre-assembled onto the lead frame in a standardized configuration before final module assembly. This preliminary preparation allows for rapid integration into the complete laser module, significantly reducing manufacturing cycle time while ensuring consistent performance through pre-validated sub-assembly configurations.
3Reliability
If conventional laser module designs are used, then functional performance is achieved, but manufacturing cost increases
Solution Approach 1:
The lead frame is designed as a low-cost, easily manufacturable substrate that can be produced through standard PCB fabrication processes. By replacing expensive custom mechanical assemblies and complex PCBA structures with a standardized lead frame platform, the overall manufacturing cost is significantly reduced while maintaining reliable laser module performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design facilitates faster manufacturing cycles, reduces equipment costs, enhances connectivity, and improves reliability while maintaining high performance.
Implementation Method 1
a diffractive optical element disposed within the cover cavity and configured to modulate a laser beam from the laser diode to generate a pattern of spots on a target surface
Implementation Method 2
The laser projection module may further comprise a heat sink configured to dissipate heat from the laser diode
Data Source
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AI summary
A laser projection module, that may include a laser projection module cover comprising a top portion, a bottom portion and a one or more of side portions to define a cavity within the cover, wherein the top portion is configured to couple an optical lens. A lead frame may be at least partially integrated into the bottom cover portion of the laser projection module, where the lead frame includes an outer lead frame portion and an inner lead frame portion relative to the cover, wherein the inner lead frame portion is configured to couple a laser diode assembly in one area of the inner lead frame portion within the cavity.