Lead Frame Multiple-Irradiation Layout for Laser-Safe Corner Regions
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Solution Overview
Problem
The intersection area of grooves in a lead frame, where laser light is applied for resin removal, can cause damage to corner regions of semiconductor devices if not properly controlled, leading to quality degradation.
Innovation Solution
A lead frame design with a multiple-irradiated region that shields the corner areas from laser light, preventing resin material removal errors and ensuring the corner regions are formed correctly during the semiconductor device manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser light is scanned along first grooves and second grooves to remove resin material, then resin removal efficiency is improved, but corner regions are damaged due to overlapping irradiation
Solution Approach 1:
The patent introduces a shielding structure (metal plate or resin plate) as an intermediary element positioned at the corner regions to block overlapping laser light. This mediator prevents the harmful overlapping irradiation from reaching the corner regions while allowing the laser to effectively remove resin from the grooves, thus resolving the contradiction between resin removal efficiency and corner region quality
Solution Approach 2:
The patent segments the lead frame structure by introducing grooves that divide the resin-filled areas into distinct regions. By creating these segmented grooves and positioning shielding structures at specific intersection points, the laser irradiation path is controlled to remove resin efficiently while protecting critical corner regions from overlapping light exposure
2Productivity
If overlapping laser irradiation is applied to groove intersection areas, then resin removal is accelerated, but corner regions become prone to damage
Solution Approach 1:
The patent applies preliminary anti-action by pre-positioning shielding structures (metal plates or resin plates) at the corner regions before laser irradiation begins. These shields are strategically placed to preemptively block overlapping laser light from reaching the corner regions, preventing damage before it can occur while allowing accelerated resin removal in non-critical areas
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents quality degradation of corner regions in semiconductor devices by effectively managing laser light exposure at the intersection of grooves, ensuring accurate formation and protection during the manufacturing process.
Implementation Method 1
a first scan step of removing the resin material from the first groove by scanning laser light over the first groove in the first direction; a second scan step of removing the resin material from the second groove by scanning laser light over the second groove in the second direction
Implementation Method 2
the multiple-irradiated region of the lead frame prevents laser light emitted to the back surface from reaching a portion of the resin material on the front surface of the lead frame
Data Source
AI summary
A lead frame has a back surface having a multiple-irradiated region that is irradiated with laser light scanned in a first scan step and laser light scanned in a second scan step, a unit resin molded product that is formed in a cutting step has corner regions overlapping the multiple-irradiated region of the lead frame, and the multiple-irradiated region prevents the laser light emitted to the back surface from reaching portions of the resin material on the front surface of the lead frame, the portions being located at a position corresponding to the corner regions.