Lead Frame Light Source Support for Imaging Module Alignment
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Solution Overview
Problem
Optimal placement of light sources in imaging modules is challenging due to difficulties in illumination and aiming, with existing solutions failing to provide precise and efficient heat dissipation and structural support.
Innovation Solution
A light source support system featuring a thermally conductive lead frame that is precisely located and fixed within a housing, providing both structural rigidity and efficient heat dissipation, while allowing for precise positioning of light sources relative to optics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light sources are placed in imaging modules using conventional methods, then assembly is simpler, but placement precision and optical alignment are insufficient
Solution Approach 1:
The patent merges multiple functions into the lead frame: it serves as both the electrical connection component and the mechanical positioning support for light sources. The lead frame's rigid structure provides precise positioning relative to optics while maintaining electrical connectivity, eliminating the need for separate mounting fixtures and reducing overall assembly complexity despite improving placement precision.
Solution Approach 2:
The lead frame is designed to perform multiple functions simultaneously: electrical conduction to light sources, mechanical support and positioning, thermal management pathway, and structural rigidity for the entire imaging module. This multi-functionality allows precise light source placement without adding separate specialized components for each function.
2Illumination intensity
If light sources are positioned for optimal optical performance, then illumination and aiming improve, but heat dissipation becomes difficult
Solution Approach 1:
The lead frame acts as an intermediary thermal pathway between the light sources and the housing. It conducts heat away from the densely positioned light sources through its thermally conductive material, distributing thermal load to the housing structure without compromising the optimal optical positioning of the light sources.
3Strength
If conventional mounting methods are used, then assembly is easier, but structural rigidity and heat removal are insufficient
Solution Approach 1:
The lead frame combines electrical connection and mechanical support functions into a single integrated component. Its rigid structure provides structural integrity to the imaging module while maintaining ease of assembly through standard lead frame mounting techniques, eliminating the need for separate structural support components.
4Volume of moving object
If light sources are densely positioned for compact design, then module size reduces, but heat accumulation increases
Solution Approach 1:
The lead frame serves as a thermal intermediary that distributes heat from multiple densely positioned light sources across its structure and into the housing. This allows compact positioning of light sources while preventing heat accumulation through efficient thermal pathways to the housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures optimal light source placement, enhances heat management, and improves the structural integrity of imaging modules, leading to improved performance and longevity of light sources.
Implementation Method 1
provided as a thermally conductive element, the light source support facilitates the removal of light source generated heat
Data Source
AI summary
An imaging module for data collection devices, such as bar code scanners. The module includes an aiming or illumination light source or sources, seated on a support is mounted in a housing. The support is fixed in the housing to provide for its precise placement therein, in a predetermined position.