Lead Frame Locking Pins for Substrate Anchoring
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Electronic components in automotive applications face reliability issues due to severe environmental conditions, requiring a robust packaging technique that can withstand extreme temperatures and exposure to elements, while also being cost-effective.
Innovation Solution
A lead frame with an integrated circuit and passive components mounted on an intermediate substrate, using locking connectors such as pins or receptacles for mechanical anchoring, which enhances the mechanical strength and reliability of the assembly, and is encapsulated in a molding compound for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive components are mounted on an intermediate substrate and connected to the lead frame, then the functionality and integration of electronic components are improved, but the mechanical strength and reliability under severe environmental conditions deteriorate
Solution Approach 1:
The patent applies preliminary action by pre-forming locking pins on the intermediate substrate before mounting passive components. These locking pins are positioned in advance to engage with corresponding receptacles on the lead frame, ensuring mechanical strength is established before the assembly undergoes environmental stress during operation.
Solution Approach 2:
The patent employs composite materials by combining the intermediate substrate (made of FR4 or similar composite material) with metal locking pins and receptacles. This composite structure integrates the electrical functionality of the substrate with the mechanical strength of metal fasteners, creating an assembly that withstands both electrical and mechanical demands of automotive environments.
2Strength
If locking connectors are used to mechanically anchor the intermediate substrate to the lead frame, then the mechanical strength is improved, but the device complexity increases
Solution Approach 1:
The patent applies merging by integrating the locking pins directly into the intermediate substrate as a unified structure rather than separate components. The locking pins are formed as integral parts of the substrate, combining the substrate's electrical function with its mechanical anchoring function, thereby reducing overall device complexity while maintaining strength.
Solution Approach 2:
The intermediate substrate is designed to be self-sufficient by incorporating locking pins as integral features. This self-service approach eliminates the need for separate fastening components and assembly steps, reducing device complexity while providing robust mechanical anchoring to the lead frame.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced mechanical anchoring and reliability of electronic components in automotive environments, preventing delamination and short circuits, and ensuring durability and cost-effectiveness by integrating passive components with integrated circuits in a single package.
Implementation Method 1
The plurality of locking pins frictionally engage the intermediate substrate and provide mechanical connection between the lead frame and the intermediate substrate
Data Source
AI summary
Consistent with an example embodiment, there is a package assembly structure. The structure comprises a lead frame having a topside surface and an opposite under-side surface; the lead frame includes a die attach paddle, wherein a die attach region is defined on the opposite under-side surface. Pad landings surround the die attach region. A plurality of locking pins are arranged at predetermined locations about the die attach paddle, on the top side surface. The plurality of locking pins may be formed integrally in the lead frame and project upward from the top side surface.