Lead Frame Layout for Low-Inductance Semiconductor Packaging
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing inductance, which affects the efficiency of electric power conversion devices, particularly in applications like electric vehicles, due to the configuration of heat dissipation members and lead frames.
Innovation Solution
The semiconductor device incorporates a lead frame with a second main terminal that includes a connection portion, a facing portion, and a non-facing portion, alternately arranged with the first main terminal, to effectively reduce inductance by optimizing the magnetic flux cancellation between heat dissipation members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation members are placed to sandwich the semiconductor element, then heat dissipation is improved, but inductance increases
Solution Approach 1:
The second main terminal is segmented into multiple portions (connection portion, facing portion, non-facing portion) that are spatially distributed. This segmentation allows the terminal to simultaneously connect to the semiconductor element and face the first heat dissipation member, creating multiple flux cancellation paths that reduce inductance while maintaining heat dissipation effectiveness.
Solution Approach 2:
The terminal structure extends in multiple spatial dimensions rather than a single linear path. The facing portion extends toward the first heat dissipation member in a direction that optimizes magnetic flux cancellation, while the connection portion maintains electrical connection. This multi-dimensional arrangement reduces inductance without compromising heat dissipation.
2Ease of manufacture
If the lead frame structure is simplified, then manufacturing is easier, but inductance reduction capability is limited
Solution Approach 1:
The second main terminal serves multiple functions simultaneously: it provides electrical connection to the semiconductor element, acts as a heat dissipation path, and creates magnetic flux cancellation by facing the first heat dissipation member. This multi-functionality achieves inductance reduction without adding separate components, maintaining manufacturing simplicity.
Solution Approach 2:
The connection portion, facing portion, and non-facing portion are merged into a single integrated terminal structure. This consolidation achieves the complex function of inductance reduction through flux cancellation while maintaining the simplicity of a single-piece lead frame manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces inductance, enhancing the efficiency of electric power conversion devices by improving heat dissipation and magnetic flux cancellation, leading to improved performance in applications such as electric vehicles.
Implementation Method 1
The non-facing portion and the first main terminal are arranged in a direction orthogonal to a thickness direction. A side surface of the first main terminal and a side surface of the non-facing portion of the second main terminal face each other.
Data Source
AI summary
A semiconductor device includes: a semiconductor element having a first main electrode and a second main electrode; a first heat dissipation member and a second heat dissipation member; and a lead frame including a first main terminal connected to the first heat dissipation member and a second main terminal connected to the second main electrode. The second main terminal includes a connection portion connected with the second main electrode, a facing portion extending from the connection portion and facing the first heat dissipation member, and a non-facing portion. The non-facing portion and the first main terminal are arranged in a direction orthogonal to a thickness direction. A side surface of the first main terminal and a side surface of the non-facing portion of the second main terminal face each other.