Lead-Frame Matrix Structure for Photoelectron Devices
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Solution Overview
Problem
The high material cost of producing photoelectron devices makes it challenging for manufacturers to maintain profitability, as the price of these devices decreases with mass production, necessitating a reduction in production costs.
Innovation Solution
A lead-frame matrix structure that alternately inserts pins from multiple lead-frame arrays, allowing for increased lead-frame density and efficient use of space, thereby reducing material waste and overall production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If traditional lead-frame arrays are used with standard spacing, then manufacturing simplicity is maintained, but lead-frame density is low and material waste is high
Solution Approach 1:
The lead-frame array is segmented into multiple independent arrays (first lead-frame array, second lead-frame array, etc.) that are alternately inserted into the matrix. Each array can be manufactured and positioned separately, allowing for optimized spacing and reduced material waste while maintaining manufacturing feasibility through modular assembly
Solution Approach 2:
Multiple lead-frame arrays are nested within the same matrix structure through alternate insertion. The first, second, and subsequent lead-frame arrays are positioned in an interleaved pattern, effectively nesting multiple functional units within a single matrix footprint, thereby increasing lead-frame density without proportionally increasing matrix size
2Loss of substance
If lead-frame density is increased to reduce material cost, then production cost decreases, but manufacturing complexity increases
Solution Approach 1:
By dividing the lead-frame structure into multiple separable arrays that are alternately inserted, the design allows each array to be manufactured using standard processes while achieving higher overall density. The segmentation enables parallel manufacturing and simplifies quality control compared to attempting to manufacture a single high-density array
Solution Approach 2:
The alternate insertion structure creates a universal matrix design that can accommodate multiple types of lead-frames (transmitter, receiver, different functions) in a standardized pattern. This multi-functional approach allows the same matrix structure to serve multiple purposes while maintaining ease of manufacture through repetition of the basic insertion unit
Data Source
AI summary
A structure of a lead-frame matrix of photoelectron devices is provided. The lead-frame matrix is used to fabricate a first lead-frame array and a second lead-frame array. In the structure of the lead-frame matrix of the photoelectron devices, pins of the first lead-frame array and pins of the second lead-frame array are alternatively inserted.