Lead-Frame Circuit Package With Multi-Layer Substrate
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Solution Overview
Problem
Existing lead-frame packaging technologies face challenges in implementing high-Q components like inductors and capacitors within a small size, leading to poor signal routing and reduced power added efficiency in RF power amplifier modules, making it difficult to achieve optimal performance and miniaturization.
Innovation Solution
The use of a multi-layer substrate with High Density Integration (HDI) or Low Temperature Co-fired Ceramic (LTCC) inside a lead-frame package, combined with exposed pads for improved grounding and signal routing, allows for the integration of high-Q components and enhanced power added efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional lead-frame packaging is used, then the package size is reduced, but the power added efficiency deteriorates and signal routing capability is poor
Solution Approach 1:
The patent transitions from a traditional two-dimensional lead-frame layout to a three-dimensional multi-layer substrate structure. The multi-layer substrate provides vertical stacking capability with multiple signal layers, ground layers, and component mounting surfaces, enabling complex RF signal routing and high-Q component integration within a compact footprint, thereby resolving the contradiction between miniaturization and performance.
Solution Approach 2:
The patent employs a composite packaging structure combining multi-layer substrate (with dielectric and conductive layers), lead-frame, and various RF components (inductors, capacitors, transistors). This composite approach allows optimization of each component's function while achieving overall system performance improvement, specifically enhancing power added efficiency through proper grounding and signal routing in the multi-layer architecture.
2Volume of moving object
If traditional lead-frame packaging is used, then the package size is reduced, but the signal routing capability deteriorates
Solution Approach 1:
The multi-layer substrate introduces vertical dimension for signal routing, with multiple conductive layers stacked vertically. This enables complex RF signal paths, impedance control, and grounding schemes that are impossible in traditional planar lead-frame designs, significantly improving signal routing capability while maintaining compact package size.
Solution Approach 2:
The patent segments the packaging structure into distinct functional layers: signal transmission layers, grounding layers, component mounting areas, and interconnection layers. This segmentation allows independent optimization of each layer's function, improving overall signal routing capability and making the package more suitable for RF power amplifier applications.
3Quantity of substance
If high-Q components are integrated in traditional lead-frame package, then the component density is increased, but the manufacturing complexity increases
Solution Approach 1:
The patent merges multiple functions into the multi-layer substrate structure: signal routing, grounding, component mounting, and interconnection are all integrated into a single substrate assembly. This consolidation reduces the number of separate manufacturing steps and assemblies required, thereby reducing manufacturing complexity despite increased component density.
Solution Approach 2:
The multi-layer substrate serves multiple functions simultaneously: it provides mechanical support, electrical grounding, signal routing, and component mounting. This multi-functionality reduces the need for separate structures and components, simplifying the overall manufacturing process while achieving high component density.
Data Source
AI summary
A lead-frame circuit package comprises a die and a substrate located thereon to route radio frequency signals to/from the die. The package preferably comprises an exposed pad on the die to receive a power amplifier device wherein the substrate is used to provide high-Q elements such as RF chokes on signal paths to/from the power amplifier device.In this manner, the design benefits from the power capabilities and improved grounding of a lead-frame conductor, whilst also achieving the routeing capabilities and small scale advantages provided by a multi-layer printed circuit substrate.