Lead Frame Noise Cancellation for IC Communication Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing communication systems between transmitters and receivers within integrated circuit packages face challenges in providing galvanic isolation while maintaining efficient communication, particularly in the presence of external magnetic noise, which can interfere with signal integrity.
Innovation Solution
The use of magnetically coupled galvanically isolated conductive loops defined in the lead frame of the integrated circuit package, where the transmitter and receiver loops are implemented using magnetically coupled galvanically isolated conductive loops, and a cancellation loop is employed to minimize noise interference by being out of phase with the transmitter loop, thereby canceling out noise signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If magnetically coupled wires are used for communication between transmitter and receiver, then galvanic isolation is achieved, but external magnetic noise interferes with signal integrity
Solution Approach 1:
The patent introduces a cancellation loop that deliberately generates a magnetic field opposite to the noise field. By winding the cancellation loop in the opposite direction and driving it with an inverted signal, the harmful noise is converted into a beneficial counteracting force that cancels the interference at the receiver, thereby improving signal integrity
Solution Approach 2:
The cancellation loop is configured in advance to produce a magnetic field that opposes the expected noise field. The loop is wound in the opposite direction and connected with inverted polarity, creating a pre-positioned counter-action that neutralizes noise before it can significantly degrade the signal
2Productivity
If traditional communication links are used in integrated circuit packages, then communication functionality is provided, but size and cost increase
Solution Approach 1:
The patent merges the communication link with the existing lead frame structure of the integrated circuit package. The lead frame traces are configured to form the transmitter and receiver loops, eliminating the need for separate communication components and reducing overall package size while maintaining communication functionality
Solution Approach 2:
The lead frame, which traditionally serves only as a mechanical support and electrical connection structure, is made multi-functional by configuring it to also serve as the magnetic coupling communication link. This universal use of the lead frame reduces component count and package size
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively provides a cost-effective, compact communication link between transmitters and receivers within integrated circuit packages, reducing the overall size and cost of the power supply while minimizing noise interference, thereby enhancing signal integrity.
Implementation Method 1
a current flowing through one wire induces a voltage across the ends of another wire. The coupling between these wires can be strengthened in various ways.
Implementation Method 2
a cancellation loop is employed to minimize noise interference by being out of phase with the transmitter loop, thereby canceling out noise signals
Data Source
Figure 1A~1B
Figure 2A
Figure 2B
AI summary
An integrated circuit package includes an encapsulation and lead frame with a portion of the lead frame disposed within the encapsulation. The lead frame includes a first conductor formed in the lead frame having a first conductive loop and a third conductive loop disposed substantially within the encapsulation. A second conductor is formed in the lead frame galvanically isolated from the first conductor. The second conductor includes a second conductive loop disposed substantially within the encapsulation proximate to the first conductive loop to provide a communication link between the first and second conductors. The third conductive loop is wound in an opposite direction relative to the first conductive loop in the encapsulation.