Lead Frame Outburst Regions for Flip Chip Solder Bump Alignment
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Solution Overview
Problem
Conventional flip chip packaging methods face challenges in precise connection between solder bumps and lead frames, leading to potential deviations in size and shape during the melting process, affecting the stability and electrical connection of semiconductor chip packages, and increasing production costs.
Innovation Solution
A lead frame with outburst regions extending from its edges is used to precisely connect with solder bumps, allowing for a one-to-one correspondence and maintaining the size and shape of solder bumps during the melting process, thereby enhancing the mechanical and electrical connection between the chip and the lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional flip chip packaging methods are used, then the chip can be connected to the lead frame, but the connection precision is poor and deviations occur during melting process
Solution Approach 1:
The lead frame is designed with outburst regions at specific locations where solder bumps need to be connected. These outburst regions create localized protrusions that provide precise positioning and larger connection areas, ensuring that each solder bump connects to the correct location on the lead frame with high precision and stability.
Solution Approach 2:
The outburst regions are pre-formed on the lead frame before the soldering process. This preliminary structural preparation ensures that when solder bumps are applied and melted, they naturally align with the outburst regions, preventing deviations and maintaining connection precision throughout the melting process without requiring additional real-time adjustments.
2Device complexity
If conventional lead frame design is used, then the structure is simple, but the size and shape of solder bumps change during melting process
Solution Approach 1:
Instead of making the entire lead frame complex, only specific outburst regions are created at the connection points. These localized outburst structures provide the necessary dimensional stability for solder bumps during melting, while the rest of the lead frame maintains its simple structure, thus resolving the contradiction between structural complexity and dimensional stability.
3Ease of manufacture
If conventional connection method is used, then the process is simple, but the electrical connection and mechanical stability are poor
Solution Approach 1:
The outburst regions are pre-formed on the lead frame to create optimal connection geometries before the soldering process. This preliminary preparation ensures that when solder bumps are applied and melted, they naturally align and connect with high precision to the outburst regions, improving both electrical connection quality and mechanical stability without complicating the overall packaging process.
4Ease of manufacture
If conventional lead frame design is used, then production costs are lower, but connection precision and reliability are reduced
Solution Approach 1:
The outburst regions are created only at specific connection points on the lead frame rather than modifying the entire structure. This localized approach minimizes the additional manufacturing complexity and cost while achieving the desired improvement in connection precision and reliability, thus resolving the contradiction between production cost and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise attachment of the chip to the lead frame, reducing deviations and improving the stability and electrical connection, while maintaining the integrity of solder bumps, thus enhancing the overall performance and reducing production costs.
Implementation Method 1
second surfaces of each of the plurality solder bumps are connected with corresponding outburst regions of the lead frame to connect the chip to the lead frame through the solder bumps
Data Source
AI summary
The present invention relates to the field of semiconductor chip packages, and more specifically to a lead frame and flip chip package device thereof. In one embodiment, a lead frame for electrically connecting a chip to outside leads, can include a plurality of lead fingers, where each of the plurality of lead fingers comprises a plurality of outburst regions extending from an edge thereof. In one embodiment, a flip chip package device can include: a chip and a plurality of solder bumps, where one surface of the chip is connected to a first surface of each of the plurality of solder bumps; and the lead frame, where second surfaces of each of the plurality solder bumps are connected with corresponding outburst regions of the lead frame to connect the chip to the lead frame through the solder bumps.