Lead Frame Package Structure for Passive Component Heat Dissipation

The connection structure is segmented into distinct functional zones: the insulation layer provides electrical insulation in regions where required, while direct thermal contact paths are maintained in specific areas through the lead frame structure. This segmentation allows simultaneous achievement of electrical insulation and thermal dissipation by separating these two functions spatially within the same connection structure.

The lead frame serves as an intermediary structure that bridges the passive component and the embedded die. It provides both mechanical support and thermal conduction pathways, while the insulation layer acts as a selective intermediary that blocks electrical current but allows thermal energy transfer through its structure, thus resolving the contradiction between electrical insulation and thermal dissipation.

The dielectric layer is applied selectively rather than uniformly across the entire connection interface. In regions where thermal dissipation is critical, the dielectric layer is either omitted or applied in thinner sections, allowing superior thermal conductance. In regions where electrical isolation is paramount, the dielectric layer provides full insulation. This local variation in dielectric presence optimizes both electrical isolation and thermal conductance simultaneously.

The connection structure employs a composite arrangement combining dielectric materials with thermally conductive materials. The dielectric layer is integrated with thermally conductive pathways (such as metal traces or thermal interface materials) to create a composite structure that simultaneously provides electrical insulation through the dielectric portion and thermal conduction through the conductive portion, thus resolving the contradiction between these two opposing requirements.