Lead Frame Optoelectronic Package Rewiring With Electrical Isolation
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Solution Overview
Problem
Existing optoelectronic semiconductor components face challenges in efficient manufacturing, including electrical isolation, inability to cross electrical potentials, and design limitations that prevent design transfer from ceramic substrates or PCBs to lead frame-based packages.
Innovation Solution
The optoelectronic semiconductor component features a mounting carrier with lead frame parts and metallizations, where through-plating regions penetrate the carrier and metallizations extend laterally, enabling efficient design combinations and electrical connections, allowing for design transfer and improved manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If lead frame-based packages are used, then manufacturing efficiency and cost are improved, but design flexibility and electrical isolation capabilities deteriorate
Solution Approach 1:
The lead frame is divided into multiple electrically isolated segments through insulation structures, allowing each segment to function independently while maintaining overall package integrity. This segmentation enables complex electrical routing and design flexibility previously unachievable with traditional lead frame packages.
Solution Approach 2:
Insulation structures are introduced as intermediary elements between lead frame segments, enabling electrical isolation and allowing the lead frame to support complex multi-voltage designs. These intermediaries resolve the conflict between lead frame simplicity and design complexity requirements.
2Adaptability or versatility
If ceramic substrates or PCBs are used for design transfer, then design flexibility is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the advantages of ceramic substrates/PCBs (design flexibility, electrical isolation) with the advantages of lead frame packages (manufacturing efficiency, cost-effectiveness) into a hybrid structure. This combination achieves complex design capabilities while maintaining simple manufacturing processes.
Solution Approach 2:
The lead frame structure is designed to perform multiple functions: electrical connection, mechanical support, and electrical isolation. This multi-functionality allows the package to accommodate complex designs while maintaining the simplicity and efficiency of lead frame manufacturing.
3Ease of manufacture
If traditional lead frame structures are used, then manufacturing simplicity is improved, but electrical isolation and rewiring capabilities deteriorate
Solution Approach 1:
Insulation structures are pre-integrated into the lead frame during manufacturing, establishing electrical isolation pathways before final assembly. This preliminary action ensures reliable electrical isolation without complicating the manufacturing process.
Data Source
AI summary
An optoelectronic semiconductor component includes at least one optoelectronic semiconductor chip, a plurality of lead frame parts, a casting body that mechanically connects the lead frame parts to one another so that a mounting carrier is formed on which the at least one optoelectronic semiconductor chip is mounted, and a plurality of metallizations, wherein the lead frame parts are each formed in one piece and comprise at least one through-plating region and at least one mounting region, the through-plating regions each penetrate the mounting carrier and the mounting regions project beyond the casting body, and the metallizations each start from at least one of the through-plating regions and extend directly onto the casting body laterally next to the at least one associated through-plating region.