Lead Frame Patch Detection Using Color Reflection Analysis
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Solution Overview
Problem
Existing semiconductor packages face issues with glue overflow during encapsulation due to imperfect attachment of the die pad and leads, leading to unequal lead bumps, short circuits, and manual removal inefficiencies.
Innovation Solution
A detection equipment and method using a color sensor and control device to analyze light reflection from patches on lead frames, determining patch presence or absence via a preset value comparison, ensuring accurate attachment before molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual removal of glue overflow is used, then removal capability is provided, but production time increases and difficult-to-remove glue remains
Solution Approach 1:
The patent applies preliminary action by detecting the presence and state of the patch before the molding process occurs. The color sensor scans the patch area and determines whether the patch is properly attached prior to encapsulation, allowing preventive measures to be taken before glue overflow becomes an issue. This early detection prevents the need for subsequent manual removal operations.
Solution Approach 2:
The patent replaces the manual mechanical removal process with an automated optical detection system. Instead of using manual tools to scrape or remove glue overflow, the system uses a color sensor to detect patch status and triggers automated control signals to prevent improper molding operations, substituting mechanical post-processing with automated pre-detection and control.
2Measurement precision
If patch detection is implemented using color sensor, then detection precision is improved, but device complexity increases
Solution Approach 1:
The patent applies local quality by focusing the color sensor's detection function specifically on the patch area of the lead frame. Rather than implementing a comprehensive inspection system for the entire semiconductor device, the system selectively monitors only the critical patch region where attachment status determines molding success. This localized approach achieves high detection precision with minimal added complexity.
Solution Approach 2:
The patent utilizes color changes as the detection mechanism. The color sensor scans the patch area and identifies patch attachment status by detecting color characteristics - the presence or absence of the patch creates distinct color signatures that the sensor can differentiate. This optical method provides precise detection without requiring complex mechanical or electrical measurement systems.
3Device complexity
If no patch detection is performed, then device complexity remains low, but glue overflow occurs causing short circuits and poor contacts
Solution Approach 1:
The patent implements feedback by using the color sensor to continuously monitor patch status and feeding this information back to the control system. The control device receives real-time detection data and adjusts molding operations accordingly - preventing molding when patch attachment is improper and enabling it when attachment is correct. This closed-loop feedback ensures product reliability without requiring overly complex system architecture.
Solution Approach 2:
The system performs preliminary detection of patch attachment status before initiating the molding process. By scanning and analyzing the patch area in advance, the system determines whether conditions are suitable for molding, preventing glue overflow issues before they occur. This preliminary action maintains simple device architecture while ensuring high product reliability through preventive detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents glue overflow and abnormal product appearance by instantly detecting patch attachment, reducing manual intervention and product scrapping, and enhancing production efficiency.
Implementation Method 1
performing color analysis and sampling of the patch via multiple light sources, so as to identify the patch by using a proportion of color components of light reflected by the patch
Data Source
AI summary
A detection equipment and a detection method for detecting whether a semiconductor device is provided with a patch, wherein multiple light sources are used to perform color analysis and sampling of the patch via a color sensor, so as to identify the patch by using a proportion of light and color components reflected by the patch, and a control device is used to receive an activation signal of the color sensor and generating a detection value, wherein if the detection value is greater than a preset value, it is determined that the semiconductor device is provided with a patch, and wherein if the detection value is less than the preset value, it is determined that the semiconductor device is not provided with a patch.