Lead Frame Plating Layout to Prevent Wire Peeling and Silver Migration

The patent applies segmentation by dividing the leads into two distinct groups: first leads with nickel plating films and second leads with silver plating films. This spatial separation prevents interaction between the two plating film types, eliminating the harmful effects of wire peeling and silver migration that occur when different plating films are mixed. Each lead group is treated independently with its appropriate plating material.

The patent implements local quality by assigning different plating film types to different lead groups based on their specific requirements. First leads receive nickel plating while second leads receive silver plating, allowing each region to have the optimal plating material for its function. This localized differentiation maintains connection reliability while preventing harmful interactions.

The patent segments the leads into first leads and second leads, allowing the stripe plating method to be applied separately to each group. This segmentation ensures that nickel plating is formed only on first leads and silver plating only on second leads, preventing relative positional shifts between different plating films while maintaining the manufacturing efficiency benefits of the stripe plating method.

The patent applies local quality by using the stripe plating method to create region-specific plating films. The first leads receive nickel plating through stripe plating while second leads receive silver plating through the same method, ensuring each local region gets the appropriate plating material without contamination or positional interference from other plating films.