Lead Frame Power Ground Bar Noise Shielding
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Solution Overview
Problem
Conventional semiconductor packages face noise coupling issues due to the traversal of bond wires over power bars, which limits design possibilities and signal integrity.
Innovation Solution
Incorporating a ground bar that is electrically grounded and positioned between the signal leads and the power bar, with portions on either side of the power bar to provide noise shielding, thereby reducing unwanted interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires traverse over the power bar to connect signal leads to the semiconductor die, then electrical connections are established, but noise coupling occurs between the power bar and signal leads
Solution Approach 1:
A ground bar is introduced as an intermediary element positioned between the power bar and signal leads. The ground bar serves as a mediator that provides a controlled reference potential, preventing direct noise coupling between the power bar and sensitive signal paths while maintaining necessary electrical connections.
Solution Approach 2:
The harmful noise coupling effect is extracted and redirected to the ground bar. By providing a dedicated ground path, the noise that would otherwise couple into signal leads is instead directed to the ground bar, which is designed to handle and dissipate such interference away from sensitive circuits.
2Adaptability or versatility
If the power bar is positioned to facilitate electrical connections, then power distribution is achieved, but design flexibility is limited due to noise coupling constraints
Solution Approach 1:
The ground bar acts as a flexible intermediary that can be positioned and configured in various ways to accommodate different design requirements. It provides a versatile solution that allows the power bar and signal leads to be arranged more freely while maintaining noise immunity through the presence of the ground reference.
Solution Approach 2:
The lead frame structure is segmented into distinct functional zones: power distribution (power bar), signal transmission (signal leads), and noise management (ground bar). This segmentation allows each element to be optimized independently for its specific function while working together as an integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances noise immunity for signals by effectively shielding them from noise coupling, allowing for improved design flexibility and signal integrity in semiconductor packages.
Implementation Method 1
Incorporating a ground bar that is electrically grounded and positioned between the signal leads and the power bar, with portions on either side of the power bar to provide noise shielding
Data Source
AI summary
A semiconductor device includes a die having first contact pads and a second contact pad. Signal leads, each having embedded portion and an exposed portion, are electrically connected to respective ones of the first contact pads. A power bar extends in an area between the signal lead embedded portions and the die and has a first side opposing the signal leads and a second side opposing the die. The power bar is electrically connected to the second contact pad. An electrically grounded ground bar extends at least partially in the area. The ground bar has a first portion between the signal lead embedded portions and the first side of the power bar, and a second portion between the second side of the power bar and the die.