Lead Frame Power Module Structure for Shorter Current Paths
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Solution Overview
Problem
Existing power modules face structural constraints due to patterns, wire bonding, and spacers, which hinder improvements in power and cooling performance.
Innovation Solution
A power module design that connects upper and lower substrates using lead frames, eliminating the need for wire bonding and spacers, and includes thicker lead frames to support and electrically connect the substrates, allowing for improved heat dissipation and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If wire bonding and spacers are used to connect substrates, then electrical connection and structural support are achieved, but device complexity and size increase
Solution Approach 1:
The patent merges the functions of wire bonding, spacer support, and electrical connection into a single integrated lead frame structure. The lead frame simultaneously provides mechanical support between substrates, establishes electrical connections through its conductive paths, and eliminates the need for separate wire bonding and spacer components, thereby reducing device complexity while maintaining reliability
Solution Approach 2:
The lead frame serves multiple functions: it acts as a structural spacer to maintain substrate spacing, provides electrical connection paths between substrates, and offers mechanical support. This multi-functionality eliminates the need for separate dedicated components for each function, reducing overall device complexity
2Strength
If traditional substrate connection methods are used, then structural support is provided, but current path length increases reducing power performance
Solution Approach 1:
The lead frame combines structural support and electrical conduction functions into a single component. By integrating the support structure and current path into the same element, the patent eliminates additional connection lengths that would be required by separate support structures and electrical connectors, thereby improving power performance while maintaining structural support
3Adaptability or versatility
If multiple components (wire bonding, spacers, patterns) are used, then functional requirements are met, but manufacturing cost increases
Solution Approach 1:
The patent consolidates multiple functional components into a single lead frame structure that performs spacing, support, and electrical connection functions simultaneously. This reduction in component count simplifies the manufacturing process, reduces assembly steps, and lowers overall manufacturing cost while maintaining all required functional capabilities
Solution Approach 2:
The lead frame is designed as a multi-functional component that replaces several separate components. By making the lead frame universal in its functionality, the patent reduces the total number of parts that need to be manufactured and assembled, thereby improving ease of manufacture and reducing cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances power performance by shortening current paths, reduces overall size, and lowers costs by eliminating spacers and simplifying circuit patterns while maintaining stable electrical connections and heat dissipation.
Implementation Method 1
the lead frame being configured to support the first substrate and the second substrate and be electrically connected to the first substrate and the second substrate
Implementation Method 2
a connection structure between an upper substrate and a lower substrate is improved to improve power performance and cooling performance
Data Source
AI summary
According to the present disclosure, upper and lower substrates may be electrically connected to a lead frame, such that wire bonding may be excluded, and electrical connection and heat dissipation may be performed without a spacer by improving a connection structure in the upper and lower substrates. In addition, a power module is introduced in which because a spacer for forming a large current path may be excluded, a current path may be shortened, such that power performance may be improved, an internal space may be additionally provided, costs may be reduced, and an overall size of the power module may be reduced.