Lead Frame Module Printed Metal Ground Interconnection
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Solution Overview
Problem
Existing electrical connectors with ground skewers to electrically common ground shields are complex, costly, and unreliable due to alignment issues, necessitating a simpler and more reliable method for providing effective electrical shielding for signal conductors.
Innovation Solution
A lead frame module with interleaved ground and signal conductors, supported by a dielectric holder, where a printed metal layer is formed on the holder's surface to electrically connect the ground conductors, providing effective shielding without the need for ground skewers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ground skewers are used to electrically common ground shields, then electrical shielding is provided, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the ground skewer component entirely from the connector assembly. Instead of using separate ground skewers to electrically common ground shields, the invention integrates ground conductor interconnection directly into the lead frame structure, where ground conductors are inherently electrically commoned through the lead frame material and configuration, eliminating the need for additional ground skewer parts.
Solution Approach 2:
The patent combines the ground conductor support function and electrical interconnection function into a single integrated lead frame structure. The lead frame simultaneously provides mechanical support for ground conductors and establishes electrical continuity between them through its conductive material and configured geometry, merging multiple functions that would otherwise require separate components.
2Reliability
If ground skewers are used to electrically common ground shields, then electrical shielding is provided, but manufacturing cost increases
Solution Approach 1:
The patent eliminates the ground skewer component and its associated tooling, assembly equipment, and labor requirements. By removing this component entirely and using the lead frame's inherent conductivity to achieve ground interconnection, the invention reduces part count, simplifies tooling requirements, and decreases assembly labor, thereby lowering overall manufacturing cost.
Solution Approach 2:
The lead frame structure automatically provides electrical interconnection between ground conductors through its own conductive material and geometric configuration, without requiring additional ground skewers or complex assembly operations. The lead frame serves its own interconnection function, eliminating the need for separate interconnection components and simplifying manufacturing.
3Reliability
If ground skewers are used to electrically common ground shields, then electrical shielding is provided, but alignment reliability decreases
Solution Approach 1:
The patent removes the ground skewer component that requires alignment with contact module openings. By eliminating ground skewers entirely and using the lead frame's integrated structure to provide ground conductor support and interconnection, the invention removes the alignment problem altogether, as no separate ground skewer needs to be positioned through openings in contact modules.
Solution Approach 2:
The patent integrates ground conductor support and electrical interconnection into the lead frame structure itself, eliminating the need for separate ground skewers that would require precise alignment. The lead frame's ground conductors are directly connected to the contact module structure, removing the alignment tolerance issues associated with ground skewer installation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances signal integrity by improving electrical isolation and reducing complexity and cost, while ensuring reliable electrical shielding between signal conductors.
Implementation Method 1
A printed metal layer is formed in situ on the first side of the dielectric holder and at least partially fills the wells and engages the ground conductors in the wells to electrically connect to the ground conductors. The printed metal layer electrically connect a plurality of the ground conductors.
Data Source
AI summary
A lead frame module includes a lead frame including ground conductors and signal conductors interleaved with the ground conductors side-by-side. The ground and signal conductors have transition portions extending between mating ends and terminating ends. A dielectric holder supports the lead frame and at least partially surrounds the transition portions of the ground and signal conductors. The dielectric holder has a first side and a second side with wells in the first side open to the transition portions of the ground conductors. A printed metal layer is formed in situ on the first side of the dielectric holder and at least partially fills the wells and engages the ground conductors in the wells to electrically connect to the ground conductors. The printed metal layer electrically connect a plurality of the ground conductors.