Semiconductor Lead Frame Recesses for Cutting Position Alignment
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in maintaining precise cutting position alignment during the half-cut and full-cut processes, leading to potential positional shifts that can affect the accuracy and quality of the final product.
Innovation Solution
A method involving a lead frame with recesses and grooves, where the cutting process is referenced to the recesses to ensure accurate alignment and minimize positional shifts, utilizing a combination of half-cut and full-cut dicing techniques to remove portions of the lead frame and sealing resin, with the recesses serving as visual markers for precise cutting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If alignment mark on lead frame is used as reference for half-cut and full-cut processes, then cutting can be performed, but positional shift between cutting positions occurs due to tolerance accumulation
Solution Approach 1:
The patent introduces a groove as an intermediary reference feature between the alignment mark and the cutting blade. The groove is formed at a predetermined position on the lead frame, and the cutting blade is positioned to cut along the groove during both half-cut and full-cut processes. This intermediary groove reference eliminates direct reliance on the alignment mark, preventing tolerance accumulation and positional shifts between cutting operations.
2Ease of manufacture
If cutting position tolerance is specified, then manufacturing can proceed, but excessive positional shift occurs when maximum tolerances accumulate in opposite directions
Solution Approach 1:
The patent performs preliminary action by forming the groove at the predetermined cutting position before the actual cutting operations. The groove serves as a pre-established reference feature that guides the cutting blade during both half-cut and full-cut processes. This preliminary groove formation ensures that subsequent cutting operations are precisely aligned, preventing tolerance accumulation and positional shifts that would otherwise occur when maximum tolerances accumulate in opposite directions.
Data Source
AI summary
A method for manufacturing a semiconductor device includes preparing a lead frame, mounting a semiconductor element on an obverse face of the lead frame, forming a sealing resin covering the semiconductor element, forming a groove on a reverse face of the lead frame, and removing a portion of the lead frame and a portion of the sealing resin along a disposal region that is narrower than the groove and entirely overlaps with the groove. The preparing of the lead frame includes forming at least one recess located in the disposal region and having an end that is open in the thickness direction. The forming of the groove includes exposing the recess on a side of the reverse face of the lead frame. The removing is performed with reference to the recess.