Lead Frame Recesses Prevent Component Displacement

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Solution Overview

Problem

In semiconductor device manufacturing, relatively tall electronic components like oscillators can experience positional displacement during resin encapsulation, leading to electrode contact with the lead frame and wire disconnection due to pressure from molding resin, causing malfunctions and stress on wires.

Innovation Solution

The use of a lead frame with a protruding or recessed structure at the bonding face, where the electronic component is bonded in a state that fits with the lead frame, preventing displacement by sandwiching a beam portion between opposing sidewalls or using a recessed structure that restricts movement during resin pouring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If relatively tall electronic components are mounted on the lead frame, then the device functionality is improved, but the electronic components may be displaced during resin encapsulation due to pressure

Engineering Contradiction:

Improvedevice functionalityVSAvoidcomponent position accuracy

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The lead frame is prepared with recesses and protrusions before component mounting. These structural features are pre-formed to specifically accommodate and secure tall electronic components, preventing their displacement during subsequent resin encapsulation processes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The recesses and protrusions act as intermediary mechanical structures between the electronic components and the lead frame. This intermediary mechanism provides secure mechanical interlocking, allowing tall components to be firmly held in place without direct reliance on adhesive bonding alone.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If electronic components are securely bonded to the lead frame, then component stability is improved, but the bonding process becomes more complex

Engineering Contradiction:

Improvecomponent stabilityVSAvoidbonding process complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The bonding interface is segmented into multiple discrete features: recesses in the lead frame, protrusions on the component, and adhesive application zones. This segmentation allows each feature to perform its specific function (mechanical retention, alignment, and bonding) independently, simplifying the overall bonding process while enhancing stability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the bonding interface have different properties: recesses provide mechanical retention, protrusions provide alignment and leverage, and specific areas are designated for adhesive application. This local differentiation of qualities allows the bonding process to achieve high stability without requiring complex overall procedures.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS10262929B2Semiconductor device with lead frame

Publication Date: 2019.04.16 LAPIS SEMICON CO LTD

AI summary

A semiconductor device and a semiconductor device manufacturing method that may prevent positional displacement of an electronic component mounted on a lead frame. The semiconductor device includes a lead frame, and an electronic component that has a protruding or recessed structure at a bonding face that bonds to the lead frame and is bonded to the lead frame, in a state in which a portion of the lead frame is fitted together with the protruding or recessed structure.