LED Lead Frame Reflection Layer Coverage for Higher Luminous Efficiency

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The luminous efficiency of semiconductor light-emitting devices is reduced due to partial absorption of light by the lead frame, as the reflection layer on the lead frame's trench-defining sidewall does not cover the entire surface effectively.

Innovation Solution

A semiconductor light-emitting device design that includes a lead frame with a side body having an inner surface covered by a reflection layer, where the reflection layer's height is not smaller than 90% of the side body's height, ensuring effective light reflection and minimizing absorption by the lead frame.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If a reflection layer is formed on the trench-defining sidewall of the lead frame, then light absorption by the lead frame is reduced, but the reflection layer only covers a part of the sidewall (height not greater than 60% of sidewall height), so light absorption is not sufficiently prevented

Engineering Contradiction:
Improvelight absorption by lead frameVSAvoidreflection layer coverage height
Core Design Contradiction:
Loss of energyVSManufacturing precision

Solution Approach 1:

The patent changes the height parameter of the reflection layer from the conventional not greater than 60% of sidewall height to not smaller than 90% of sidewall height. This parameter change ensures that the reflection layer covers substantially the entire trench-defining sidewall, effectively preventing light absorption by the lead frame while maintaining manufacturing feasibility.

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If the reflection layer covers the entire sidewall (height >= 90% of sidewall height), then light absorption is significantly reduced, but the manufacturing precision and uniformity of the reflection layer formation become more challenging

Engineering Contradiction:
Improvelight absorption by lead frameVSAvoidreflection layer formation process
Core Design Contradiction:
Loss of energyVSEase of manufacture

Solution Approach 1:

The patent introduces a curved portion in the trench-defining sidewall with a specific slope range (tan 40° to tan 60° at 50% height of curved portion). This curvature design optimizes the surface for reflection layer formation, ensuring uniform coverage up to 90% or more of the sidewall height while facilitating the manufacturing process through controlled geometric features.

Inventive Principle:
Principle #14Spheroidality (Curvature)

3Ease of manufacture

If the trench-defining sidewall has a large and uniform slope, then the structure is simple to manufacture, but the reflection layer can only cover a part of the sidewall and has insufficient height coverage

Engineering Contradiction:
Improvesidewall structure fabricationVSAvoidreflection layer coverage
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent replaces the large and uniform slope with a curved portion that has a gradually increasing slope from bottom to top, with the slope at 50% height ranging from tan 40° to tan 60°. This curved design maintains manufacturing simplicity while enabling the reflection layer to achieve comprehensive coverage of at least 90% of the sidewall height, resolving the contradiction between ease of manufacture and coverage precision.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The enhanced reflection layer coverage significantly reduces light absorption by the lead frame, thereby improving the luminous efficiency of the semiconductor light-emitting device.

Implementation Method 1

a reflection layer is generally formed on a trench-defining sidewall of the lead frame... light emitted from the light-emitting element is partially absorbed by the lead frame, thereby lowering the luminous efficiency

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS12302675B2Semiconductor light-emitting device
Publication Date: 2025.05.13 QUANZHOU SANAN SEMICON TECH CO LTD
  • US12302675B2 patent drawing
  • US12302675B2 patent drawing

AI summary

A semiconductor light-emitting device includes a lead frame, a light-emitting element, and a reflection layer. The lead frame includes a main body and a side body extending upwardly from the main body. The main body and the side body cooperatively define a receiving space. The side body has an inner surface facing the receiving space, and a first height measured from a surface of the main body. The light-emitting element is disposed on the surface of the main body and in the receiving space. The reflection layer covers at least a part of the inner surface, and has a second height measured from the surface of the main body. The second height is not smaller than 90% of the first height.