Lead Frame Resin Interface to Prevent Package Delamination
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Solution Overview
Problem
Conventional semiconductor devices face malfunctions due to thermal stress, which causes detachment of the sealing resin and potential cracking of conductive members like solder and wires, leading to reliability issues.
Innovation Solution
A semiconductor device design that incorporates a resin composition with enhanced bonding strength, covering the bonded regions between conductive members and the lead frame, while exposing part of the semiconductor element's front surface to prevent thermal stress-induced detachment and cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealing resin directly covers the bonded region between conductive members and lead frame, then device structure is simple, but thermal stress causes detachment of sealing resin and malfunction
Solution Approach 1:
The patent introduces a resin composition as an intermediary layer between the sealing resin and the bonded region. This resin composition has superior bonding strength to both the lead frame and conductive members compared to the sealing resin, acting as a mediator that prevents detachment caused by thermal stress while maintaining overall structural integrity.
Solution Approach 2:
The patent uses a composite material structure consisting of two different resin materials: the sealing resin for encapsulation and the resin composition for enhanced bonding at the bonded region. This composite approach combines the advantages of both materials to achieve both protection and strong adhesion.
2Reliability
If resin composition with greater bonding strength is applied to cover bonded regions, then detachment prevention is improved, but manufacturing process complexity increases
Solution Approach 1:
The patent segments the encapsulation function into two distinct materials: the sealing resin for general encapsulation and protection, and the resin composition specifically for bonding at the bonded region. This segmentation allows each material to perform its specialized function optimally.
Solution Approach 2:
The resin composition is applied locally only at the bonded regions where conductive members meet the lead frame, rather than throughout the entire device. This localized application provides enhanced bonding strength precisely where thermal stress concentration occurs, while minimizing additional manufacturing complexity.
Data Source
AI summary
A semiconductor device includes a semiconductor element, a lead frame, a conductive member, a resin composition and a sealing resin. The semiconductor element has an element front surface and an element back surface facing away in a first direction. The semiconductor element is mounted on the lead frame. The conductive member is bonded to the lead frame, electrically connecting the semiconductor element and the lead frame. The resin composition covers a bonded region where the conductive member and lead frame are bonded while exposing part of the element front surface. The sealing resin covers part of the lead frame, the semiconductor element, and the resin composition. The resin composition has a greater bonding strength with the lead frame than a bonding strength between the sealing resin and lead frame and a greater bonding strength with the conductive member than a bonding strength between the sealing resin and conductive member.