Stacked Lead Frame and Heat Radiating Frame Resin Sealing Inspection
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with built-in heat radiating plates face challenges in resin sealing and inspection, leading to increased production costs and reduced yield, as well as reliability issues due to the inability to perform resin-unfilled error inspections effectively without using the caulking technique.
Innovation Solution
A method involving a stacked configuration of lead frames and heat radiating frames during resin sealing, followed by separating the heat radiating frame and inspecting for resin-unfilled regions on the lead frame, allowing for accurate detection and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the heat radiating plate is coupled to the lead frame before resin sealing using the caulking technique, then the heat radiating plate can be securely fixed, but the number of processes increases leading to increased production cost and reduced yield
Solution Approach 1:
The patent combines the heat radiating frame with the lead frame structure, where the heat radiating frame serves dual purposes: providing structural support for the heat radiating plate and enabling resin sealing. This integration eliminates the need for separate caulking processes while maintaining secure fixation, thereby improving production yield without compromising fixing strength.
2Reliability
If the heat radiating frame is present during resin sealing, then the heat radiating plate can be sealed together with the semiconductor chip, but resin-unfilled error inspection cannot be performed due to obstruction by the heat radiating frame
Solution Approach 1:
The patent divides the heat radiating frame into separable portions that can be removed after resin sealing. The frame body is separated from the lead frame, allowing inspection personnel to access and inspect the sealing body for resin-unfilled errors. This segmentation maintains sealing completeness during manufacturing while enabling subsequent inspection accessibility.
3Manufacturing precision
If halogen-free sealing resins with high fluidity are used, then the sealing resin can fill gaps more effectively, but the resin flow becomes dispersive causing resin-unfilled errors to appear in various spots rather than being centralized
Solution Approach 1:
The patent introduces a removable heat radiating frame structure as an intermediary that guides and contains the resin flow during sealing. This frame structure prevents the dispersive flow pattern of high-fluidity halogen-free resins, ensuring complete fill while maintaining error detectability. After sealing, the frame is removed to enable inspection of the sealing body.
Data Source
AI summary
Reliability of a semiconductor device is improved. A method for manufacturing the semiconductor device includes the steps of: providing a lead frame having a semiconductor chip mounted thereon; providing a heat radiating frame having a heat radiating plate; and resin sealing the semiconductor chip and the heat radiating plate with the lead frame and the heat radiating frame in a stacked state. The method further includes the steps of: separating a frame body of the heat radiating frame from the lead frame having a sealing body; and applying an inspection to detect resin-unfilled regions to the lead frame having the sealing body. Since the frame body of the heat radiating frame shielding an inspection region is removed before the inspection, it becomes possible to perform the inspection using transmitted light.