Semiconductor Lead Frame Resin Structure Against Lead Deformation
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Solution Overview
Problem
The deformation of lead frames during semiconductor device manufacturing due to external forces or weight application leads to reduced yield and connection failures between semiconductor chips and leads.
Innovation Solution
A method involving the use of a first sealing resin to integrate leads with a frame member, forming a lead frame intermediate body, which is then used to mount the semiconductor chip, thereby preventing deformation and ensuring stable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If leads are arranged around the die pad without additional support, then the device structure is simpler, but the leads deform under external forces or weight application
Solution Approach 1:
The patent applies preliminary action by integrating leads with frame members through sealing resin before the semiconductor chip is mounted and weighted. This advance integration stabilizes the lead frame structure, preventing deformation when the chip is later placed and weighted, without requiring complex additional support structures.
2Stability of the object's composition
If leads are integrated with frame members using sealing resin, then lead frame stability is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the leads and frame members into a single integrated structure using sealing resin. This combination stabilizes the lead frame while using conventional semiconductor packaging materials and processes, avoiding the need for complex additional manufacturing steps or specialized equipment.
3Reliability
If leads are secured firmly to prevent deformation, then connection reliability is improved, but the flexibility in lead arrangement is reduced
Solution Approach 1:
The sealing resin acts as an intermediary material that bonds leads to frame members. It provides sufficient adhesion to prevent lead deformation and ensure connection reliability, while still allowing the leads to be arranged in various configurations around the die pad according to design requirements.
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a plurality of leads that each includes a lead body portion which has a mounting portion which includes an upper surface whereon a semiconductor chip is bonded, and a lead connecting portion for external connection which projects downward from a lower surface of the lead body portion, a first sealing resin that seals a space that is defined by each lead body portion and each lead connecting portion of the plurality of leads in a region below the upper surface of each lead body portion of the plurality of leads, and a second sealing resin that seals the semiconductor chip in a region above the upper surface of each lead body portion of the plurality of leads.