Lead Frame Rolling Indents for Mold Compound Adhesion
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Solution Overview
Problem
Existing methods for enhancing the adherence of molding compound to lead frames in packaged electronic devices are costly and impractical, particularly due to the high expenses and long lead times associated with techniques like selective etching and stamping, which also limit the ability to create unique shapes for mechanical interconnection and electrical conductivity.
Innovation Solution
A method and system involving rolling a roller with protrusions across a lead frame to create indents, using controlled pressure and temperature, which allows for the formation of mold locking features without the need for expensive etching or stamping processes, thereby improving adherence and reducing delamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If selective etching is used to create interlocking shapes for mechanical adherence, then adherence to molding compound is improved, but manufacturing cost increases due to additional chemicals and masks
Solution Approach 1:
The patent changes the method parameter from chemical etching to mechanical rolling, creating indented features through physical deformation rather than chemical removal. This eliminates the need for additional chemicals and masks while achieving the same interlocking function for mold adherence.
Solution Approach 2:
The patent replaces the chemical system (etching with chemicals and masks) with a mechanical system (rolling with protrusions). The mechanical rolling process creates indented features that provide the same interlocking function without requiring chemical materials or complex masking steps.
2Reliability
If stamping is used to provide locking shapes, then mechanical interconnection is improved, but initial investment cost increases due to stamp tooling and customized inserts
Solution Approach 1:
The patent replaces the stamping mechanical system with a rolling mechanical system. Instead of using expensive stamp tools and customized inserts, the rolling process uses a simpler roller with protrusions that can be applied to create indented features, eliminating the need for high initial tooling investment.
Solution Approach 2:
The patent employs a simpler, less expensive roller tool instead of costly stamp tools. The roller can be easily manufactured and replaced if needed, making it a more economical short-term solution compared to the high initial investment required for stamp tooling that lasts longer but costs much more upfront.
3Reliability
If additional roughening processes are used to enhance adherence, then mechanical interconnection is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the roughening function with the existing rolling process used for creating lead frame features. By integrating the adherence enhancement into the rolling step itself (through protrusions on the roller), the patent eliminates the need for separate roughening processes, thereby reducing manufacturing cost while improving adherence.
Solution Approach 2:
The patent makes the rolling process multi-functional by designing the roller with protrusions that simultaneously create both the lead frame features and the surface roughening for enhanced adherence. This universal approach combines multiple functions into a single process step, reducing the need for additional expensive processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rolling process effectively creates unique mold locking features that enhance mechanical interconnection and electrical conductivity while reducing delamination, offering cost savings and faster lead frame changes compared to traditional methods.
Implementation Method 1
rolling a roller with a protrusion across a lead frame to create an indent in a feature of the lead frame
Implementation Method 2
engaging the lead frame to a chuck and controlling the chuck temperature during rolling
Data Source
AI summary
A method includes rolling a roller with a protrusion across a lead frame to create an indent in a feature of the lead frame, attaching a die to a die attach pad of the lead frame, coupling the die with a lead, and enclosing portions of the die, the die attach pad, and portions of the lead frame feature with a molding compound. A system includes a roller with a cylindrical body and a protrusion, a chuck to engage a lead frame, and a controller to roll the roller across the lead frame to create an indent in a feature of the lead frame. An integrated circuit includes a package structure enclosing a first portion of a lead and a first portion of a die attach pad, and a rolled indent in the first portion of the lead or the die attach pad.


