Semiconductor Module Lead Frame for Scalable Rated Current
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Solution Overview
Problem
Conventional semiconductor modules require dedicated design for each rated current, leading to increased development and manufacturing costs, as well as a complex manufacturing process, due to the need for customized lead frames for different current ratings.
Innovation Solution
A semiconductor module design featuring a lead frame with complementary void parts in its joining structures, allowing multiple modules to be connected in parallel and adjusting the rated current value based on the number of modules, enabling standardized production across various current ratings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If dedicated lead frame designs are used for each rated current, then the semiconductor module can be optimized for specific current requirements, but the development cost and manufacturing cost increase
Solution Approach 1:
The lead frame is designed with a standardized structure that can serve multiple current rating functions through modular semiconductor element configuration. The joining structures include void parts that allow flexible arrangement of semiconductor elements to achieve different current ratings (e.g., 100A, 200A, 300A) using the same lead frame design, eliminating the need for dedicated lead frames for each current rating.
Solution Approach 2:
The lead frame's joining structures are segmented into modular units with void parts that can accommodate different numbers and configurations of semiconductor elements. This segmentation allows the same lead frame to be configured for various current ratings by simply changing the number and arrangement of semiconductor elements, rather than redesigning the entire lead frame.
2Reliability
If dedicated lead frame designs are used for each rated current, then the semiconductor module can meet specific current specifications, but the development period increases
Solution Approach 1:
A single standardized lead frame design with joining structures containing void parts can fulfill multiple current specification requirements. This universality reduces the development period by eliminating the need to create and validate separate lead frame designs for each current rating, while still maintaining compliance with different current specifications through modular semiconductor element configuration.
Solution Approach 2:
The current rating parameter is changed by varying the number and configuration of semiconductor elements within the standardized joining structures, rather than changing the lead frame design itself. This allows different current ratings to be achieved through parameter adjustment of the semiconductor element arrangement, significantly reducing development time.
3Reliability
If dedicated lead frame designs are used for each rated current, then the semiconductor module can be optimized for specific applications, but the manufacturing process becomes complex
Solution Approach 1:
The standardized lead frame with joining structures containing void parts serves as a universal platform for multiple applications and current ratings. This reduces manufacturing process complexity by consolidating what would otherwise require multiple dedicated manufacturing processes into a single standardized process that accommodates various configurations through modular semiconductor element placement.
Solution Approach 2:
The void parts within the joining structures provide localized flexibility for configuring semiconductor elements according to specific current rating requirements, while the overall lead frame structure remains standardized. This local quality approach allows application-specific optimization without complicating the global manufacturing process.
Data Source
AI summary
The present invention is intended to provide a semiconductor module and a semiconductor device that are compatible with various rated currents. A semiconductor module includes a lead frame, and a semiconductor element joined with the lead frame. The lead frame includes a first joining structure and a second joining structure. The first joining structure includes a void part as a part at which the lead frame does not exist, and the second joining structure includes a void part as a part at which the lead frame does not exist. Each of the first joining structure and the second joining structure has a shape such that one of the first joining structure and the second joining structure complements at least part of the void part of the other assuming that the first joining structure and the second joining structure are overlapped.