Lead Frame-Based Semiconductor Package Design
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Solution Overview
Problem
Existing power semiconductor packages face significant size increases for small changes in I/O pin count, requiring different lead frame designs, which is wasteful and inefficient.
Innovation Solution
A lead frame-based semiconductor package design with uniformly sized blocks and a common base, allowing for flexible I/O terminal count adaptation without size increases or lead frame redesigns, using a mold compound to encapsulate the die and connections, and optionally severing the common base for electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a standard power semiconductor package uses fixed I/O pin counts (48, 64, etc.), then the package design is simplified, but the package size increases dramatically for small I/O pin count changes and different lead frame designs are required for different package types
Solution Approach 1:
The lead frame is segmented into multiple groups of blocks, where each group can be independently configured. The blocks are arranged in a grid pattern with uniform spacing, allowing selective activation of blocks based on required I/O pin count. This segmentation enables a single lead frame design to accommodate various I/O configurations without requiring complete redesign.
Solution Approach 2:
The lead frame is designed with universal block structures that can serve multiple functions. The same lead frame with uniform blocks can be used for different I/O pin counts (48, 64, etc.) and different power semiconductor package types by simply activating different subsets of blocks, making the lead frame multi-functional and adaptable to various applications.
2Adaptability or versatility
If the package size is increased to accommodate more I/O pins, then more I/O terminals can be provided, but the package size increases dramatically even for small I/O pin count changes
Solution Approach 1:
The lead frame employs a dynamic configuration where blocks can be selectively activated or deactivated based on the required I/O pin count. Instead of a fixed structure that requires size increase for additional pins, the dynamic block activation allows the same physical footprint to provide different I/O capacities, preventing unnecessary package size enlargement.
Solution Approach 2:
The invention changes the parameter of block activation rather than changing the physical package size. By varying which blocks are activated (a configurable parameter) rather than increasing package dimensions, the system achieves different I/O pin counts without proportional increases in package area, maintaining compact packaging while providing I/O flexibility.
Data Source
AI summary
A semiconductor package includes: a lead frame having a plurality of blocks of uniform size and laterally spaced apart from one another with uniform spacing; a first semiconductor die attached to a first group of the blocks; electrical conductors connecting a plurality of input/output (I/O) terminals of the first semiconductor die to a second group of the blocks, at least some blocks of the second group being laterally spaced outward from the blocks of the first group; and a mold compound encapsulating the first semiconductor die and the electrical conductors. Corresponding methods of producing the semiconductor package are also described.