Semiconductor Module Sidewall Bonding for Crack-Resistant Lead Frames
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Solution Overview
Problem
Existing semiconductor modules face challenges in maintaining structural stability and enhancing electrical characteristics due to potential crack generation in the conductive connection members bonding the circuit substrate and lead frame structures.
Innovation Solution
The semiconductor module design includes a circuit substrate structure with a first conductive pad, a semiconductor chip with a second conductive pad, a lead frame structure, and a molding structure with a recess exposing the lower sidewall of the lead frame. A conductive connection member covers both the lower surface and sidewall of the lead frame, ensuring a secure bond and enhanced electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive connection member bonds the circuit substrate and lead frame structures, then electrical connection is achieved, but crack generation occurs reducing structural stability
Solution Approach 1:
The conductive connection member transitions from a conventional planar configuration to a three-dimensional structure that extends in multiple directions. It contacts the lead frame structure not only at the lower surface but also along the sidewalls, creating a multi-dimensional bonding geometry that distributes stress and prevents crack propagation while maintaining electrical connection.
Solution Approach 2:
The conductive connection member is divided into distinct functional segments: a first portion that contacts the circuit substrate, a second portion that contacts the lower surface of the lead frame, and side portions that contact the sidewalls of the lead frame. This segmentation allows each portion to optimize its bonding function independently, improving overall connection reliability while reducing stress concentration.
2Reliability
If the molding structure covers the lead frame structure, then protection is provided, but the lower sidewall of the lead frame remains exposed creating vulnerability
Solution Approach 1:
The molding structure is designed with a recess that creates a localized exposure zone for the lower sidewall of the lead frame structure. This selective exposure allows the conductive connection member to access and bond to the sidewalls while the rest of the lead frame remains protected by the molding structure, providing localized protection where needed while enabling bonding where required.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents or reduces crack generation in the conductive connection members, thereby enhancing the structural stability and electrical characteristics of the semiconductor module.
Implementation Method 1
a first conductive connection member contacting the first conductive pad and the lead frame structure and bonding the first conductive pad and the lead frame structure with each other
Data Source
AI summary
A semiconductor module comprises a circuit substrate structure comprising a first conductive pad at an upper portion thereof, a semiconductor chip on the circuit substrate structure and comprising a second conductive pad at a lower portion thereof, a lead frame structure contacting the second conductive pad, a molding structure covering a surface of the semiconductor chip and a sidewall of the lead frame structure and comprising a recess at a lower surface facing the circuit substrate structure, and a first conductive connection member contacting the first conductive pad and the lead frame structure and bonding the first conductive pad and the lead frame structure with each other. A lower sidewall of the lead frame structure is exposed by the recess, and the first conductive connection member covers the lower sidewall of the lead frame structure exposed by the recess.