Power Semiconductor Assembly With Lead-Frame Sidewall Insulation
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Solution Overview
Problem
Ensuring reliable insulation between the lead frame and the temperature sensing diode chip is challenging when mounted on the surface electrode of a power semiconductor device.
Innovation Solution
Providing an insulating film on the side surfaces of the lead frame facing the temperature sensing diode chip improves the insulation reliability between the lead frame and the temperature sensing diode chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the temperature sensing diode chip is mounted on the surface electrode together with the lead frame, then the device structure is simplified and manufacturing is easier, but the insulation reliability between the lead frame and the temperature sensing diode chip deteriorates
Solution Approach 1:
An insulating film is introduced as an intermediary layer between the lead frame and the temperature sensing diode chip. This film prevents direct contact between the conductive lead frame and the diode chip, ensuring electrical insulation while allowing both components to be mounted together on the surface electrode, thus maintaining manufacturing simplicity while improving insulation reliability.
Solution Approach 2:
A thin insulating film is applied to the lead frame structure to provide electrical insulation. This thin film approach maintains the compact mounting structure while preventing electrical breakdown between the lead frame and the temperature sensing diode chip, solving the insulation problem without compromising the simplified mounting architecture.
2Area of stationary object
If the lead frame and temperature sensing diode chip are mounted close together on the surface electrode, then the device area is reduced, but the insulation between them becomes more difficult to ensure
Solution Approach 1:
The insulating film serves as a mediator that enables close proximity mounting of the lead frame and temperature sensing diode chip while maintaining adequate electrical insulation. This allows the components to be positioned close together for compact device area without requiring increased spacing that would compromise insulation or increase device footprint.
Data Source
AI summary
A power semiconductor device includes a power semiconductor chip being a chip of a power semiconductor element, a temperature sensing diode chip being a chip of a temperature sensing diode element mounted in a first region on a surface electrode being one of main electrodes of the power semiconductor chip, and a lead frame connected to a second region on the surface electrode. An insulating film is provided on a side surface of the lead frame facing the temperature sensing diode chip.