Lead Frame Siloxane Coating for Single-Step Adhesion Improvement
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Solution Overview
Problem
Current methods for manufacturing lead frames are inefficient and lack a streamlined process for forming a siloxane layer, which is crucial for enhancing adhesion and durability in semiconductor packages.
Innovation Solution
A method involving the formation of a siloxane layer on a conductive pattern by applying a surface treatment solution containing an alkaline substance and a silicon-containing compound, where the siloxane layer is formed through an electro-deposition or dipping process, reacting the silicon-containing compound with the hydroxyl group to bond with the conductive pattern in a single process, improving adhesion and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-step processes are used to form the siloxane layer, then the adhesion and durability are improved, but the manufacturing complexity and time increase
Solution Approach 1:
The patent combines multiple process steps (surface treatment, oxide layer formation, and siloxane layer formation) into a single integrated electro-deposition process. The surface treatment solution contains both the alkaline substance for oxide formation and the silicon-containing compound for siloxane formation, allowing both layers to be formed simultaneously in one step, thereby reducing manufacturing complexity while maintaining adhesion and durability
Solution Approach 2:
The invention uses a composite surface treatment solution that combines an alkaline substance (for forming oxide layer with hydroxyl groups) and a silicon-containing compound (for forming siloxane layer). This composite approach allows the formation of a multi-layered structure with enhanced adhesion and durability properties through the synergistic interaction of different materials in a single process
2Reliability
If conventional multi-step processes are used to form the siloxane layer, then the adhesion and durability are improved, but the manufacturing time increases
Solution Approach 1:
The patent combines multiple process steps (surface treatment, oxide layer formation, and siloxane layer formation) into a single integrated electro-deposition process. The surface treatment solution contains both the alkaline substance for oxide formation and the silicon-containing compound for siloxane formation, allowing both layers to be formed simultaneously in one step, thereby reducing manufacturing time while maintaining adhesion and durability
Solution Approach 2:
The electro-deposition process operates continuously to form both the oxide layer and siloxane layer in sequence within a single treatment step. The alkaline substance first forms the oxide layer, then the silicon-containing compound reacts with the hydroxyl groups to form the siloxane layer, all within the same continuous process, eliminating idle time between steps and improving manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the bonding force between the lead frame and the molding film, improving the durability and reliability of semiconductor packages by forming a structured and uniform siloxane layer, thereby simplifying the manufacturing process and increasing efficiency.
Implementation Method 1
bonding the silicon-containing compound to the conductive pattern by causing the hydroxyl group and the silicon-containing compound to react each other
Implementation Method 2
the siloxane layer may be formed by an electro-deposition process
Data Source
AI summary
According to embodiments of the present disclosure, a method of manufacturing a lead frame includes preparing a base frame on which a conductive pattern is formed, preparing a surface treatment solution containing an alkaline substance and a silicon-containing compound, and forming a siloxane layer on the conductive pattern by applying the surface treatment solution onto the base frame, wherein the forming of the siloxane layer includes forming an oxide layer including a hydroxyl group bonded to the conductive pattern, and bonding the silicon-containing compound to the conductive pattern by causing the hydroxyl group and the silicon-containing compound to react with each other, and the reacting of the silicon-containing compound and the forming of the oxide layer are performed in a single process.