Lead Frame Assembly With Sine Wave Inductor
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Solution Overview
Problem
Integrated circuit dies require connection to passive circuit elements like inductors, which are typically provided as separate discrete components, increasing manufacturing complexity and cost.
Innovation Solution
A leadframe assembly is created with sine wave-shaped wires attached to leads, forming an inductor on the leadframe, allowing for the integration of inductive components directly onto the package, reducing the need for separate leadframes and lowering production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inductors are provided as separate discrete components connected to the integrated circuit die, then the inductor functionality is achieved, but the manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the inductor component with the leadframe structure by forming sine wave-shaped wires directly on the leadframe. This integration eliminates the need for separate discrete inductor components and their associated connection processes, thereby reducing manufacturing complexity while maintaining the inductor functionality. The inductor is now part of the leadframe assembly itself rather than a separate component.
2Ease of manufacture
If inductors are provided as separate discrete components, then the inductor functionality is achieved, but the production cost increases
Solution Approach 1:
By combining the inductor function with the leadframe structure through sine wave-shaped wires, the patent eliminates the need for separate inductor components. This reduction in component count directly lowers production costs by reducing material costs, assembly costs, and testing costs associated with multiple discrete components.
3Productivity
If sine wave-shaped wires are used to form inductors on the leadframe, then the manufacturing process is simplified and costs are reduced, but the structural complexity of the leadframe increases
Solution Approach 1:
The patent employs sine wave-shaped (curved) wires instead of straight wires to form the inductor on the leadframe. This curved geometry is essential for creating the inductive element while maintaining a compact form factor. The curvature allows the wire to occupy more space within a smaller footprint, achieving the required inductance value without increasing the overall package size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs by integrating inductors onto the leadframe, enhancing the efficiency of integrated circuit package production.
Implementation Method 1
A first generally sine wave-shaped wire having a first end and a second end has the first end thereof attached to a first one of the first plurality of leads and the second end thereof attached to a second one of the first plurality of leads to form an inductor on the leadframe
Data Source
AI summary
A leadframe assembly includes a leadframe having a die attach pad and a first plurality of leads. A first generally sine wave-shaped wire having a first end and a second end has a first end of thereof attached to a first one of the first plurality of leads and the second end thereof attached to a second one of the first plurality of leads. A method of making a leadframe assembly includes forming an inductor on a leadframe by bending a first wire into a generally sine wave-shaped configuration and attaching the first wire to a first set of leads of the leadframe.