Lead Frame Contact Solder Ball Anchoring for Low-Profile BGA
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Solution Overview
Problem
Existing semiconductor devices face challenges such as high manufacturing costs, increased thickness, and detachment of solder balls in ball grid array (BGA) packages, particularly in producing low-profile and cost-effective thin BGA packages.
Innovation Solution
A semiconductor device with lead frame contact areas having openings for solder balls that extend outwardly, an adhesive layer between the IC and die pad, and a method involving etching processes to form and anchor solder balls for improved mechanical anchoring and reduced intermetallic material, allowing for low-profile solder bumps and reduced manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional BGA packaging is used, then solder balls can be attached to the circuit board, but manufacturing cost increases and thickness increases
Solution Approach 1:
The patent merges the lead frame contact area with the solder ball anchoring function by forming openings directly in the lead frame contact areas. This integration eliminates the need for separate anchoring structures and reduces the number of manufacturing steps, thereby lowering manufacturing cost while maintaining reliable solder ball attachment.
Solution Approach 2:
The lead frame contact areas are segmented with openings to create anchoring features for solder balls. This segmentation allows the solder balls to be mechanically anchored within the openings, providing reliable attachment without requiring additional components or increasing overall package thickness.
2Reliability
If traditional BGA packaging is used, then solder balls can be attached to the circuit board, but package thickness increases
Solution Approach 1:
The patent utilizes the vertical dimension by forming openings that extend through the lead frame contact areas. The solder balls are positioned within these openings, allowing them to extend outwardly from the package surface. This dimensional approach enables mechanical anchoring without increasing the overall package thickness, as the anchoring feature is created within the existing lead frame structure rather than adding external components.
3Productivity
If solder balls are attached in traditional BGA packages, then electrical connections are established, but solder ball detachment occurs
Solution Approach 1:
The openings are formed in the lead frame contact areas before solder ball attachment. This preliminary action creates pre-prepared anchoring features that mechanically secure the solder balls during the attachment process. The solder balls are then placed into these pre-formed openings, ensuring proper positioning and mechanical interlocking that prevents detachment during subsequent handling and operation.
4Length of stationary object
If low-profile BGA packages are manufactured, then package thickness is reduced, but manufacturing cost increases
Solution Approach 1:
The lead frame contact areas serve multiple functions: they provide electrical connection pathways, mechanical support for the IC, and anchoring features for solder balls through the integrated openings. This multi-functionality eliminates the need for separate components or additional manufacturing steps, achieving low-profile packaging without increasing manufacturing cost.
Data Source
AI summary
A semiconductor device may include an integrated circuit (IC), and lead frame contact areas adjacent the IC. Each lead frame contact area may have an opening therein. The semiconductor device may include bond wires, each bond wire coupling a respective lead frame contact area with the IC. The semiconductor device may also include encapsulation material surrounding the IC, the lead frame contact areas, and the bond wires. Solder balls are within the respective opening.