Lead Frame Solder Bridge Layout to Prevent Solder Scattering
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Solution Overview
Problem
Existing semiconductor modules face challenges in maintaining reliable connections between lead frames and semiconductor chips due to solder scattering issues caused by low solder wettability with non-metallic protective films, leading to potential defects and reduced connection reliability.
Innovation Solution
The use of a solder bridge formed above a second region of the protective film with a narrower width, which prevents solder scattering by ensuring the solder remains between the lead frame and the chip connecting portion, maintaining a reliable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is applied to connect the lead frame and semiconductor chip, then electrical connection is established, but solder scattering occurs causing defective connections
Solution Approach 1:
The protective film acts as an intermediary element between the solder and the surrounding environment. By strategically designing the film's regions, it mediates solder flow to achieve proper connections while preventing scattering to adjacent areas.
Solution Approach 2:
The protective film provides localized control over solder behavior - allowing solder to wet and adhere in the first region while the narrower second region confines and directs solder flow, preventing it from scattering to defective locations.
2Manufacturing precision
If the protective film width is reduced to prevent solder scattering, then solder placement precision improves, but the protective coverage area decreases
Solution Approach 1:
The protective film is segmented into a first region with wider coverage for general protection and a second region with narrower width for precise solder control. This segmentation maintains adequate protective coverage while creating the necessary constraint for preventing solder scattering.
Solution Approach 2:
Different widths are assigned to different regions of the protective film - the first region maintains sufficient width for protection while the second region has a narrower width specifically where solder flow control is critical, achieving both protection and precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents solder scattering and maintains the reliability of connections between pad electrodes and wires, suppressing defective connections and ensuring consistent performance.
Implementation Method 1
a solder bridge formed above a second region of the protective film with a narrower width than the first region
Implementation Method 2
ensuring the solder remains between the lead frame and the chip connecting portion
Data Source
AI summary
Provided is a semiconductor device including: a temperature sensing portion provided above a semiconductor substrate; a temperature sensing wiring portion electrically connected to the temperature sensing portion; and a protective film including a temperature sensing protective film provided above the temperature sensing portion and a first wiring protective film provided above the temperature sensing wiring portion, where the first wiring protective film includes: a first region adjacent to the temperature sensing protective film; and a second region provided more spaced apart from the temperature sensing protective film than the first region and having a width narrower than that of the first region.