Semiconductor Lead Frame Heating for Faster Solder Bonding
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Solution Overview
Problem
The existing solder bonding process in semiconductor device manufacturing is time-consuming due to the slow melting of solder when heated from the substrate side.
Innovation Solution
A semiconductor device and manufacturing method that utilize a substrate, semiconductor chip, lead frame, nut, and nut box with an opening to expose the nut downward, where the semiconductor device is loaded on a lower jig with a metal projection that contacts the nut, allowing heat to be transferred efficiently through the lead frame to melt the solder quickly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of time
If solder is heated from the substrate side only, then the heating path is simple, but the solder melting time is long
Solution Approach 1:
The heating function is segmented into two independent heating paths: one from the substrate side and another from the nut/lead frame side. This allows simultaneous heating from multiple locations, reducing the overall time required to melt the solder while maintaining a relatively simple overall structure.
Solution Approach 2:
The heating approach transitions from a single-direction (one-dimensional) heat path through the substrate to a multi-directional (three-dimensional) heating system. By adding the nut and lead frame as additional heat conduction paths, heat can reach the solder from multiple spatial dimensions simultaneously, significantly reducing melting time.
2Reliability
If the nut box bottom is closed, then the structure is simple and compact, but heat cannot be efficiently transferred to the solder
Solution Approach 1:
The bottom portion of the nut box is extracted or removed to create an opening, allowing the heating projection to directly contact the nut and transmit heat efficiently. This extraction of the bottom closure enables reliable thermal contact while adding minimal structural complexity.
Solution Approach 2:
The opening in the nut box bottom acts as an intermediary structure that facilitates thermal contact between the heating projection and the nut. This design enables efficient heat transfer from the projection through the nut to the solder, improving bonding reliability while maintaining structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid solder melting, improving the efficiency and reliability of the solder bonding process and reducing the time required for bonding the semiconductor chip and substrate or lead frame.
Implementation Method 1
heating the lower jig with the projection brought into contact with the nut and bonding the semiconductor chip and the substrate or the lead frame to each other with the solder
Data Source
AI summary
A semiconductor device according to the disclosure includes a substrate, a semiconductor chip provided on the substrate, a nut, a lead frame provided on the semiconductor chip and the nut and screwed to the nut, a nut box accommodating the nut and having an opening which exposes the nut downward formed in a bottom portion and solder provided at least between the semiconductor chip and the substrate or the lead frame.