Lead-Wire Frame Recess Structure for Stress-Balanced Sensor Packaging

The patent applies curvature by designing arc-shaped packaging interfaces at the interface between the molding body and metal frame. These curved surfaces replace sharp right-angle transitions, allowing stress to be distributed more evenly across the interface during thermal expansion and contraction. The arc-shaped design prevents stress concentration at corners and edges, thereby reducing the risk of interface delamination and structural deformation while maintaining reliable packaging protection.

The patent introduces arc-shaped packaging interfaces that replace the traditional right-angle design between the molding body and metal frame. This curved interface design maintains manufacturing feasibility while significantly improving interface strength by eliminating stress concentration points. The gradual transition provided by the arc shape allows for more uniform stress distribution during thermal cycling, preventing interface delamination without substantially complicating the manufacturing process.

The patent implements aligned arc-shaped packaging interfaces on both the inner and outer contours of the recess in the metal frame. These curved interfaces are positioned to work together in alignment, creating a balanced stress distribution pattern. The arc shapes on both contours are designed to coordinate during thermal expansion and contraction, generating offsetting stresses that maintain equilibrium. While this adds some structural complexity compared to a simple flat interface, the symmetrical alignment of the arc shapes provides a systematic approach to stress management.