Lead Frame Power Module Structure for Low-Resistance Substrate Linking
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Solution Overview
Problem
The existing double side cooling type power modules with via spacers experience increased electrical resistance, leading to higher heat generation and a more complex structure due to the additional space required for the spacers.
Innovation Solution
A power module design that replaces the via spacer with a lead frame unit, which electrically connects the substrates and provides a transmission path for power and signals, eliminating the need for additional space and reducing electrical resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a via spacer is used to electrically connect two substrates in a double side cooling type power module, then the electrical connection between substrates is achieved, but the electrical resistance increases and heat generation increases
Solution Approach 1:
The patent merges the functions of the via spacer and the lead frame by integrating the via spacer into the lead frame structure. The lead frame's other side is configured to contact both substrates directly, eliminating the need for a separate via spacer component while maintaining electrical connection functionality. This integration reduces the number of interfaces and contact points, thereby reducing electrical resistance and heat generation.
Solution Approach 2:
The lead frame is designed to perform multiple functions: it provides structural support for the power module, serves as an electrical connection path between substrates, and integrates the via spacer function within its structure. By making the lead frame multi-functional, the patent eliminates the dedicated via spacer component, reducing electrical resistance and simplifying the overall structure.
2Reliability
If a via spacer is disposed between two substrates to electrically connect them, then electrical connection is established, but the structure becomes more complicated and additional space is required
Solution Approach 1:
The patent combines the via spacer function with the lead frame structure, eliminating the need for a separate via spacer component. The lead frame's other side is configured to contact both substrates directly, integrating multiple functions into a single component and simplifying the overall module structure.
Solution Approach 2:
The lead frame is designed to perform multiple functions including structural support, electrical connection, and via spacer functionality. This multi-functional design reduces the number of components needed and simplifies the structural complexity of the power module.
3Reliability
If a via spacer is used to electrically connect substrates, then electrical connection is achieved, but the volume of the via spacer increases the overall module size
Solution Approach 1:
The patent integrates the via spacer function into the lead frame structure, eliminating the need for a separate via spacer component. This integration reduces the overall volume required for the electrical connection mechanism, as the lead frame already occupies space in the module and its other side can directly contact both substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces electrical resistance, lowers heat generation, simplifies the structure, and enhances the reliability and durability of the power module while improving assembly performance and material efficiency.
Implementation Method 1
a lead frame unit, one side of which is connected to an external circuit, and the other side of which is provided between the first and second substrates, to electrically connect the first and second substrates
Data Source
AI summary
A power module is disclosed. A power module according to an embodiment of the present disclosure may include a first substrate and a second substrate spaced apart from each other, an electronic device unit provided on at least either one of the first and second substrates, and a lead frame unit provided between the first and second substrates. One side of the lead frame unit may be connected to an external circuit, and the other side thereof may be configured to electrically connect the first and second substrates. Accordingly, the lead frame unit may perform a function of electrically connecting the first and second substrates instead of a via spacer in the related art.