Lead Frame Surge Protection for Multi-Chip Modules
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Solution Overview
Problem
Existing multi-chip modules, such as RS-485 transceiver ICs, are vulnerable to electromagnetic interference (EMI) and high-voltage pulses, which can damage the ICs, and external surge protection devices require additional space and cost.
Innovation Solution
A lead frame with integrated surge protection ICs, where semiconductor diodes are arranged to flank an RS-485 transceiver IC, providing electrical connections to ground and voltage supply, and configured to short and conduct current responsive to breakdown voltages, thereby bypassing high surge currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external surge protection devices (MOVs, TVS diodes, gas discharge tubes) are used, then surge protection capability is improved, but PC board space is increased and cost is increased
Solution Approach 1:
The patent combines the surge protection function with the existing lead frame structure by integrating surge protection ICs directly into the lead frame. The lead frame's conductor structures are configured to provide both mechanical support and electrical connection paths for surge protection, merging the protection function with the existing structural component rather than adding separate external devices.
Solution Approach 2:
The lead frame is designed to serve multiple functions: it provides mechanical support for the ICs, establishes electrical connections, and simultaneously provides surge protection capability through its conductor structure configuration. The conductor structures are arranged to flank the ICs and provide both structural framework and protection functionality.
2Reliability
If external surge protection devices (MOVs, TVS diodes, gas discharge tubes) are used, then surge protection capability is improved, but cost is increased
Solution Approach 1:
The patent combines the surge protection function with the existing lead frame structure by integrating surge protection ICs directly into the lead frame. The lead frame's conductor structures are configured to provide both mechanical support and electrical connection paths for surge protection, merging the protection function with the existing structural component rather than adding separate external devices.
Solution Approach 2:
The lead frame is designed to serve multiple functions: it provides mechanical support for the ICs, establishes electrical connections, and simultaneously provides surge protection capability through its conductor structure configuration. The conductor structures are arranged to flank the ICs and provide both structural framework and protection functionality.
3Area of stationary object
If surge protection ICs are integrated into the lead frame, then PC board space is reduced, but device complexity is increased
Solution Approach 1:
The lead frame is divided into separate conductor structures, with first and second conductor structures positioned to flank the ICs. Each conductor structure is independently configured to provide specific functions (mechanical support, electrical connection, surge protection), allowing the complex protection functionality to be organized into manageable segments rather than a monolithic structure.
4Reliability
If conductor structures are spaced apart and electrically isolated, then surge protection effectiveness is improved, but electrical connection complexity is increased
Solution Approach 1:
The lead frame is divided into separate conductor structures, with first and second conductor structures positioned to flank the ICs. Each conductor structure is independently configured to provide specific functions (mechanical support, electrical connection, surge protection), allowing the complex protection functionality to be organized into manageable segments rather than a monolithic structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated surge protection ICs within the lead frame effectively bypass high surge currents to the RS-485 transceiver IC, enhancing protection without the need for external devices, while maintaining compliance with the RS-485 standard and preserving board space and cost efficiency.
Implementation Method 1
The surge protection ICs are configured to short and conduct current responsive to a breakdown voltage, thereby bypassing current through the third IC
Data Source
AI summary
A lead frame for a multi-chip module includes a first conductor structure disposed on a substrate and having first and second arms linked at an angle. The first conductor structure is connected to ground. The lead frame also includes a second conductor structure disposed on the substrate and connected to a voltage supply. The second conductor structure is spaced apart and electrically isolated from the first conductor structure. The first and the second conductor structures are arranged to flank a plurality of integrated circuits (ICs) including one or more surge protection ICs disposed on the substrate. The first conductor structure is electrically connected to the plurality of ICs to provide electrical connections to ground, and the second conductor structure is electrically connected to the plurality of ICs to provide electrical connections to the voltage supply.