Integrated Lead Frame Layout for Variable Terminal Lengths
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Solution Overview
Problem
Existing semiconductor devices with conductive lead frames struggle to form lead terminals of different lengths without altering the frame's width, limiting design flexibility and manufacturing efficiency.
Innovation Solution
A lead frame configuration featuring first and second terminal portions with varying widths, where first recess portions along the first terminals allow for different terminal lengths without changing the frame's width, enabling the formation of long and short terminals that are alternately arranged, and connected to a frame portion that supports the semiconductor element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If recesses are provided adjacent to all terminals to separate lead terminals after mounting, then lead terminals can be separated individually, but lead terminals with different terminal lengths cannot be formed without changing width of the frame portion
Solution Approach 1:
The patent applies local quality by providing recesses only at specific positions adjacent to certain terminals rather than uniformly at all terminal positions. This selective recess configuration allows some terminals to have extended lengths while maintaining a consistent frame width, thereby achieving terminal length variation without increasing the overall frame dimension.
2Reliability
If lead terminals with different terminal lengths are arranged alternately in staggered arrangement, then insulation property between lead terminals is improved, but device complexity increases
Solution Approach 1:
The patent segments the terminal arrangement into two distinct groups: terminals with recesses and terminals without recesses. This segmentation creates the staggered arrangement where long and short terminals alternate, improving insulation by increasing spacing between adjacent terminals of the same length while maintaining a relatively simple overall structure through systematic repetition of the pattern.
Data Source
AI summary
Provided is a lead frame of a semiconductor device in which lead terminals with different terminal lengths can be formed without changing width of a frame portion. A lead frame includes: a first terminal portion in which a plurality of first terminals is arranged side by side; a second terminal portion in which a plurality of second terminals wider than the first terminals is arranged side by side; and a frame portion to which a tip end portion of each of the first terminals and the second terminals is connected, wherein first recess portions recessed along the first terminals are provided in the frame portion, and wherein the first terminal portion includes the first terminal the tip end portion of which is sandwiched between the adjacent first recess portions and the first terminal the tip end portion of which is not sandwiched between the adjacent first recess portions.