Lead Frame Extended Pad Layout for Stable Wedge Bonding
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Solution Overview
Problem
Conventional semiconductor devices face challenges in reliably bonding connection members due to potential shaking or deformation of the bonding portion during the wedge bonding process, which affects the integrity of the electrical connections.
Innovation Solution
The electronic device design includes a lead frame configuration with a first lead having a pad portion and an extended portion that allows for stable bonding of connection members, where the extended portion is positioned between the die pad and the second lead, ensuring secure attachment and minimizing deformation during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wedge bonding is performed by applying pressure and vibration to the wire end and bonding portion, then electrical connection is achieved, but the bonding portion shakes or deforms affecting bonding reliability
Solution Approach 1:
The lead is pre-formed with an extended portion that extends toward the bonding portion before the bonding process. This preliminary structural preparation provides a stable base that prevents shaking and deformation during the subsequent wedge bonding operation, ensuring reliable electrical connection without compromising bonding portion stability
Solution Approach 2:
The extended portion of the lead acts as an intermediary element between the bonding portion and the wire. It serves as a stable anchor point that mediates the bonding process by absorbing vibrations and preventing direct transmission of mechanical stress to the bonding portion, thereby maintaining bonding reliability while preventing deformation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables suitable bonding of connection members, ensuring reliable electrical connections and preventing deformation of the bonding portion, thereby enhancing the stability and efficiency of the bonding process.
Implementation Method 1
The wire is bonded to the bonding portion through wedge bonding. In wedge bonding, pressure and vibration are applied to the end portions of the wire.
Data Source
AI summary
An electronic device includes an electronic component provided with a first electrode pad, a die pad including an obverse surface facing in a first direction with the electronic component mounted on the obverse surface, a first lead, a second lead, and a first connection member electrically connecting the first electrode pad and the first lead to each other. The first lead and the second lead are disposed, as viewed in the first direction, on a same side of the die pad in a second direction perpendicular to the first direction. The first lead includes a first pad portion and a first extended portion. The first connection member is bonded to the first pad portion. The first extended portion extends from the first pad portion up to a position located between the die pad and the second lead as viewed in the first direction.