Lead Frame Conductive Wire Arrangement for Sensor Terminal Flexibility

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Solution Overview

Problem

Existing lead frames with parallel conductive wires require complex bending structures or detour wires to accommodate external devices with different terminal arrangements, reducing productivity due to the need for custom configurations.

Innovation Solution

A lead frame design featuring three or more conductive wires with L-shaped turns and distinct bending directions allows for rearrangement of connector terminals relative to contact electrodes, enabling flexible alignment without complex structures or detour wires by using L-shaped turns and crank portions to manage wire interference during assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive wires are arranged in parallel without crossing to maintain arrangement order, then connection reliability is improved, but productivity deteriorates due to required detour wires and complicated bending structures

Engineering Contradiction:
Improveconnection reliabilityVSAvoidproductivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies dimensional change by transitioning from a 2D planar arrangement to a 3D spatial configuration. The conductive wires are arranged in parallel in the plan view (maintaining arrangement order) but are positioned at different heights (Z-axis) to eliminate the need for detour wires and complicated bending structures, thereby improving productivity while maintaining connection reliability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces dynamic positioning of conductive wires at different heights, allowing the lead frame to adapt to different terminal arrangements. This dynamic spatial configuration enables straightforward wire routing without requiring detour wires or complex bending structures, thus improving productivity while maintaining reliable connections.

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If detour wires or complicated bending structures are formed to accommodate different terminal arrangements, then adaptability is improved, but manufacturing complexity increases and productivity decreases

Engineering Contradiction:
Improveadaptability to different terminal arrangementsVSAvoidlead frame structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent uses the Z-axis (height dimension) to provide adaptability for different terminal arrangements. By positioning conductive wires at different heights, the lead frame can accommodate various terminal configurations without requiring detour wires or complicated bending structures in the plan view, thus reducing manufacturing complexity while maintaining adaptability.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements a dynamic spatial arrangement where conductive wires can be positioned at different heights to adapt to various terminal arrangements. This dynamic configuration eliminates the need for complex detour wires and bending structures, reducing device complexity while maintaining versatility.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If detour wires or complicated bending structures are used to change terminal arrangement order, then adaptability is improved, but assembly time increases

Engineering Contradiction:
Improveterminal arrangement flexibilityVSAvoidassembly time
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

The patent applies dimensional change by using the Z-axis to provide terminal arrangement flexibility. Conductive wires are positioned at different heights, allowing straightforward routing that reduces assembly time compared to traditional methods requiring detour wires or complicated bending structures in the plan view.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces dynamic spatial positioning of conductive wires at different heights, enabling flexible terminal arrangements with simplified routing. This reduces assembly time by eliminating the need for complex detour wires and bending operations while maintaining adaptability to different terminal configurations.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS11255869B2Lead frame and sensor device using same
Publication Date: 2022.02.22 MITSUBISHI ELECTRIC MOBILITY CORP
  • US11255869B2 patent drawing
  • US11255869B2 patent drawing
  • US11255869B2 patent drawing

AI summary

Provided are a lead frame that allows changing of arrangement of contact electrodes, and a sensor device using the same. The lead frame is configured such that, when conductive wires having contact electrodes are developed on a plane, the conductive wires extend from the contact electrodes so as not to cross each other and are turned at first turned portions. The inner two wires are defined as a first group, and the remaining wires are defined as a second group. Each first group conductive wire has a second and a third turned portion turned in the opposite direction, the first group conductive wires are bent in opposite to the second group conductive wires, using, as an axis of a bending portion.