Lead-Free Glass Paste Composition for Heat-Resistant Chip Resistors
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Solution Overview
Problem
Existing lead-free glass pastes used in chip resistors have poor high temperature resistance, failing to meet the thermal requirements of chip resistors due to the generation of heat during operation.
Innovation Solution
A lead-free glass paste composition comprising 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent, which is prepared by mixing and curing these components to form a protective layer with enhanced thermal stability, achieving a heat-resistant temperature of 640°C or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If lead oxide is replaced to achieve lead-free glass paste, then environmental compliance is improved, but high temperature resistance deteriorates
Solution Approach 1:
The patent uses a composite glass paste formulation containing multiple components including glass fiber powder (2-3 parts by mass), borosilicate oil (6-7 parts by mass), aluminum oxide powder (12-21 parts by mass), and a curing agent (0.1-0.5 parts by mass). This composite structure combines the thermal stability of glass fibers with the binding properties of borosilicate oil and the high-temperature resistance of aluminum oxide, achieving both lead-free compliance and heat resistance of 640°C or more.
Solution Approach 2:
The patent modifies the chemical composition parameters of the glass paste by precisely controlling the ratios of different components. The glass fiber powder content is set at 2-3 parts by mass, borosilicate oil at 6-7 parts by mass, and aluminum oxide powder at 12-21 parts by mass. These parameter adjustments optimize the balance between environmental compliance and thermal performance, enabling the paste to withstand temperatures of 640°C or more without lead oxide.
2Quantity of substance
If existing lead-free glass paste formulations are used, then lead content is reduced, but thermal stability deteriorates
Solution Approach 1:
The patent creates a composite material system where glass fiber powder provides the structural framework for thermal stability, borosilicate oil serves as the binding matrix, and aluminum oxide powder acts as a high-temperature filler. This composite structure achieves complete lead elimination while maintaining thermal stability through the synergistic effects of its components, with the glass fiber network providing structural integrity at elevated temperatures.
Solution Approach 2:
The patent achieves zero lead content by completely replacing lead oxide with alternative materials. The formulation parameters are optimized with glass fiber powder at 2-3 parts by mass, borosilicate oil at 6-7 parts by mass, and aluminum oxide powder at 12-21 parts by mass. These parameter changes fundamentally alter the material's thermal behavior, enabling the lead-free paste to maintain compositional stability at temperatures of 640°C or more.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The lead-free glass paste provides both environmental compliance and superior thermal stability, ensuring the chip resistor's performance under high temperatures while adhering to environmental protection regulations.
Implementation Method 1
The curing agent is added into the mixture for curing and the cured mixture is crushed to obtain the lead-free glass paste.
Data Source
AI summary
A lead-free glass paste, a chip resistor and a method for producing the same are provided. The lead-free glass paste includes 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent.