Lead-Free Low Melting Glass Sealing Material for Multilayered Glass Panels
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Solution Overview
Problem
The challenge is to achieve high thermal insulation and reliable hermetic sealing in multilayered glass panels while maintaining mechanical strength, as conventional low melting glasses with lower sealing temperatures compromise mechanical strength and thermal expansion matching with glass substrates.
Innovation Solution
A sealing material comprising lead-free low melting glass particles with vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads, where the volume fraction of glass beads is between 10% to 35% and the low melting glass fraction is higher than the filler fraction, ensuring mechanical strength and thermal expansion matching with the glass substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional lead-based or bismuth-based low melting glass is used for sealing, then sealing temperature can be maintained at high levels (400°C or higher), but mechanical strength of the seal deteriorates and thermal expansion matching with glass substrates becomes difficult
Solution Approach 1:
The patent changes the chemical composition parameters of the sealing glass by incorporating specific ratios of V2O5 (5-65 wt%), TeO2 (15-50 wt%), and Ag2O (10-60 wt%), which fundamentally alters the melting characteristics and mechanical properties of the sealing material, enabling low-temperature sealing with maintained strength
Solution Approach 2:
The invention creates a composite sealing glass system combining multiple oxides (vanadium phosphate glass base with tellurium and silver oxide additives) that synergistically improve both low-temperature meltability and mechanical strength, resolving the trade-off between sealing temperature and seal integrity
2Loss of energy
If resin is used for spacers to achieve low thermal conductivity and low sealing temperature, then thermal insulation improves, but hermetic sealing becomes difficult due to resin's lower thermal resistance
Solution Approach 1:
The patent introduces a specialized low-melting glass sealing material as an intermediary between the resin spacer and the glass substrates, which can bond to both the resin and glass at low temperatures while providing the necessary hermetic seal, thus mediating between the conflicting requirements of low thermal conductivity and reliable sealing
3Stress or pressure
If the number of spacers is increased to secure space inside the panel for high vacuum, then vacuum insulation improves, but thermal insulation deteriorates due to metal spacers' high thermal conductivity
Solution Approach 1:
The patent changes the thermal conductivity parameter of the spacer material by switching from metal to resin-based materials with low thermal conductivity, which fundamentally alters the thermal performance while maintaining the structural function of spacing and vacuum sealing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the mechanical strength and reliability of the seal, allowing for lower sealing temperatures, improved thermal insulation, and reduced manufacturing costs, making the multilayered glass panels suitable for widespread application in building materials.
Implementation Method 1
The Ag2O-V2O5-TeO2-based lead-free low melting glass has a softening point in the temperature range of 268°C to 320°C, and softens and fluidizes at a much lower temperature than a conventional lead-based or bismuth-based low melting glass
Implementation Method 2
a volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%; and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content
Data Source
Figure 1A~1B
Figure 2
Figure 3A~3B
AI summary
The present invention provides a highly reliable multilayered glass panel and an encapsulating material for achieving the highly reliable multilayered glass panel. The encapsulating material includes lead-free low melting glass particles containing vanadium oxide and tellurium oxide, low thermal expansion filler particles, and glass beads as a solid content. A volume fraction of the glass beads in the solid content is not less than 10% to not more than 35%, and a volume fraction of the lead-free low melting glass particles in the solid content is larger than a volume fraction of the low thermal expansion filler in the solid content.