Lead-Free Solder Surface Coating and Filtration for Micro Soldering
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Solution Overview
Problem
Conventional soldering methods result in poor appearance with protrusions and bumps, solder bridges causing short circuits, and lack of flowability, making them unsuitable for precision manufacturing of micro components like micro LEDs, and lead to increased CO2 emissions due to excess solder usage and mixing of solids like oxides which affect the aesthetics and durability of tin articles.
Innovation Solution
A method for manufacturing a solder product with improved flowability and reduced solids and acicular crystals, using a lead-free solder alloy with a carboxylic acid surface layer to prevent oxidation and moisture absorption, and a filtration process to remove impurities, allowing for finer soldering and reduced environmental impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional soldering methods are used, then soldering process is simple, but solder has poor appearance with protrusions and bumps
Solution Approach 1:
The patent applies preliminary action by filtering the molten solder before it is applied to the workpiece. The filtration step removes impurities and solids from the molten solder in advance, preventing the formation of protrusions and bumps during soldering. This preliminary purification ensures high appearance quality without requiring complex post-processing steps.
2Reliability
If conventional soldering methods are used, then soldering process is simple, but solder bridges cause short circuits
Solution Approach 1:
The patent removes solids and impurities from the molten solder before application through filtration. This preliminary action prevents solder bridges from forming by ensuring the solder flows smoothly and uniformly without solid particles that could cause bridging between adjacent electrical connections.
3Quantity of substance
If conventional solder is used, then soldering process is simple, but solder lacks flowability requiring increased solder usage
Solution Approach 1:
The patent filters the molten solder to remove solids and impurities before application. This preliminary purification improves the flowability of the solder, allowing it to spread more efficiently and uniformly. As a result, less solder is required to achieve complete coverage and proper joint formation, reducing overall solder consumption.
4Ease of manufacture
If solids are present in molten metal, then manufacturing process is simple, but bending and cutting become difficult
Solution Approach 1:
The patent applies preliminary filtration to remove solids from the molten metal before the metal is processed into final products. This preliminary action prevents solids from interfering with subsequent bending and cutting operations, ensuring ease of post-processing without requiring complex remedial measures later.
5Manufacturing precision
If conventional soldering is used for micro components, then soldering process is simple, but solder solids project from solder pockets causing misalignment
Solution Approach 1:
The patent filters the molten solder to remove all solids before the solder is applied to micro components. This preliminary purification is critical for micro component soldering because even small solid particles can project from tiny solder pockets and cause misalignment. The filtration ensures smooth, uniform solder flow that precisely fills solder pockets without solid projections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method provides a solder product with enhanced flowability and wettability, reducing solder usage and emissions, preventing solder bridges, and improving the aesthetics and durability of tin articles by minimizing solids and acicular crystals, enabling precise soldering of micro components.
Implementation Method 1
a lead-free solder alloy with a carboxylic acid surface layer to prevent oxidation and moisture absorption
Implementation Method 2
a filtration process to remove impurities
Implementation Method 3
provides greater flowability of solder during soldering
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A solder product 20 includes: a lead-free solder part 21 containing tin as a main component and a metal element other than lead as a secondary component; and a carboxylic acid having 10 to 20 carbons, the carboxylic acid being mainly distributed over the surface of the solder product 20 to form a surface layer 22. The carboxylic acid is preferably a fatty acid having 12 to 16 carbons, and more preferably a palmitic acid.