Semiconductor Lead Grooves for Resin Anchoring Under Thermal Stress
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Solution Overview
Problem
Existing semiconductor devices face issues with the adhesion between leads and sealing resins, leading to potential peeling off of the sealing resin and defects in the bonding layer and wires due to thermal stress.
Innovation Solution
The semiconductor device incorporates a lead with a main surface featuring a plurality of grooves recessed from the surface and located apart from each other, which enhances the anchoring effect of the sealing resin, thereby improving adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sealing resin is applied directly on the flat main surface of the lead, then the manufacturing process is simple, but the adhesion between the lead and sealing resin is insufficient under thermal stress
Solution Approach 1:
The lead main surface is formed with multiple grooves that create a porous-like structure, allowing the sealing resin to penetrate and anchor into the grooves. This increases the effective bonding area and mechanical interlocking between the lead and sealing resin, significantly improving adhesion strength while maintaining manufacturing feasibility through standard groove formation processes.
Solution Approach 2:
The invention transitions from a two-dimensional flat surface contact to a three-dimensional anchored structure by forming grooves that extend into the lead surface. The sealing resin not only contacts the surface but also fills and anchors into the grooves, creating multi-level bonding interfaces that enhance adhesion in the vertical dimension while preserving horizontal manufacturing simplicity.
2Ease of manufacture
If the adhesion between lead and sealing resin is weak, then the manufacturing process is simpler, but the sealing resin peels off and cracks occur in the bonding layer due to thermal strain
Solution Approach 1:
The grooved structure creates a porous-like anchoring pattern on the lead surface. The sealing resin penetrates these grooves during application, forming mechanical interlocks that resist peeling forces. This porous structure increases the effective bonding area and distributes thermal stresses more evenly, preventing crack propagation in the bonding layer while maintaining manufacturing simplicity.
3Reliability
If the adhesion between lead and sealing resin is improved by surface treatment, then the bonding strength increases, but the manufacturing complexity increases
Solution Approach 1:
Instead of complex surface treatments like coating or chemical etching, the invention uses a relatively simple groove formation process to create a porous-like structure. This geometric modification alone provides sufficient anchoring for the sealing resin, achieving high adhesion strength without introducing complex materials or multi-step surface treatment processes, thus minimizing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the bonding strength between the lead and the sealing resin, reduces the likelihood of peeling and cracking, and prevents pitting corrosion on wires, while also improving heat dissipation and manufacturing efficiency.
Implementation Method 1
the lead is formed with a plurality of grooves that are recessed from the main surface and are located apart from each other... the plurality of grooves are located away from a peripheral edge of the main surface... enhances the anchoring effect of the sealing resin
Data Source
AI summary
There is provided a technique that includes: a lead having a main surface facing in a thickness direction; a semiconductor element mounted over the main surface; and a sealing resin that is in contact with the main surface and covers the semiconductor element, wherein the lead is formed with a plurality of grooves that are recessed from the main surface and are located apart from each other, and wherein the plurality of grooves are located away from a peripheral edge of the main surface.